Regular Paper

[OPTICAL REVIEW Vol. 21, No. 5 (2014) 605-613]
© 2014 The Japan Society of Applied Physics

Electrooptic Sensor Module Fabrication for Near-Field Intrabody Communication

Akinori FURUYA1*, Ai-ichiro SASAKI1, Hiroki MORIMURA1, Osamu KAGAMI1, and Mitsuru SHINAGAWA2†

1NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
2Hosei University, Faculty of Science and Engineering, Koganei, Tokyo 184-8584, Japan

(Received September 27, 2013; Accepted June 2, 2014)

In this paper, we describe how to obtain a low cost electrooptic (EO) sensor module for the mass production of near-field intrabody communication devices. In our previous study, we used a bulk cleavage technique to fabricate EO modulators without the need for any optical polishing or washing processes. In this study, we fabricated EO modulators as a miniaturized chip sensor without a base portion, and clarified the feasibility of assembling optical components by only a passive alignment technique with a compact housing.

Key words: electrooptic sensor, near field, intrabody communication, ZnTe, quasi-electrostatic field, M2M


*E-mail address: furuya.akinori@lab.ntt.co.jp
E-mail address: m.shina@hosei.ac.jp

 

© 1994-2014 The Japan Society of Applied Physics
Produced, Developed, and Maintained by The Optical Society of Japan (An Affiliate of the Japan Society of Applied Physics)
Printed in Japan by Komiyama Printing Co., Ltd.

mail to Editorial Office, OPTICAL REVIEW