[OPTICAL REVIEW Vol. 7, No. 1 (2000) 54-57]
Two-Dimensional Alignment-Free Optical Interconnect Using Micro Optical Bench Scheme
Yasuhiko AOKI, Yuji SHIMADA, Rogerio Jun MIZUNO and Kenichi IGA
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama, 226-8503 Japan
(Received March 28, 1999; Accepted October 27, 1999)
In this paper, we have proposed and demonstrated a novel packaging method involving a vertical cavity surface emitting laser (VCSEL) array. The concept is based on micro optical bench (MOB) placing a laser sub-mount and two-dimensional optical fiber array to match the reference plane of MOB to provide an alignment free optical interconnect. No degradation of I-V and I-L characteristics of the packaged VCSELs was found after use of the proposed packaging process. The coupling loss was about 0.9 dB for λ=1.55 μm and the loss deviation among channels was less than 0.5 dB in a 2×4 ch coupling module between planar microlens and multi-mode fibers.
Key words : micro optical bench, planar microlens, vertical cavity surface emitting laser, optical interconnect