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Regular paper[OPTICAL REVIEW Vol. 10, No. 4 (2003) 335-338]
Exposure Simulation Model for Chemically Amplified ResistsSang-Kon KIM* Department of Physics, Hanyang University, 17 Haengdang-dong, Seongdong-gu, Seoul, 133-791 South Korea (Received November 27, 2002; Accepted May 6, 2003) In this study, after Dill's model is discussed for transmittance and refractive indices of the non-chemically amplified resists, G- and I-line novolak resists, and the chemically amplified resists, a modification of Dill's model as a new exposure model is introduced. The simulation results obtained using this new model with the multi-thin film interface method and the Berning theory have shown a good matching to the experimental data. Also, the simulated transmittance change due to the exposure parameters are used to analyze the influence of the coefficients on the transmittance. Key words: 193-nm lithography, lithography simulation, chemically amplified resist, exposure, exposure simulation *E-mail address: sangkona@hotmail.com |
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