Akinori FURUYA^1*, Ai-ichiro SASAKI¹, Hiroki MORIMURA¹, Osamu KAGAMI¹, and Mitsuru SHINAGAWA^2†

¹NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan
²Hosei University, Faculty of Science and Engineering, Koganei, Tokyo 184-8584, Japan

(Received September 27, 2013; Accepted June 2, 2014)

In this paper, we describe how to obtain a low cost electrooptic (EO) sensor module for the mass production of near-field intrabody communication devices. In our previous study, we used a bulk cleavage technique to fabricate EO modulators without the need for any optical polishing or washing processes. In this study, we fabricated EO modulators as a miniaturized chip sensor without a base portion, and clarified the feasibility of assembling optical components by only a passive alignment technique with a compact housing.

Key words: electrooptic sensor, near field, intrabody communication, ZnTe, quasi-electrostatic field, M2M

^*E-mail address: furuya.akinori@lab.ntt.co.jp
^†E-mail address: m.shina@hosei.ac.jp