Yu-Hsuan LIN^*, Chih-Chung YANG, Tai-San LIAO, Han-Chao CHANG, and Kuo-Cheng HUANG

Instrument Technology Research Center, National Applied Research Laboratories, Hsinchu 30076, Taiwan

(Received March 17, 2014; Revised May 16, 2014; Accepted May 26, 2014)

In this paper, a novel method for the analysis of damaged V-grooves is presented. An optical sectioning system and image processing software were developed to determine the width of V-grooves at various heights. We succeeded in constructing a three-dimensional (3D) topographic image, which enabled the estimation of damage in each region of the V-groove. The necessity of replacing damaged wire guide rollers can be determined according to whether the damage in the V-grooves exceeds a given threshold. By altering the sampling rate, the proposed system can achieve an optimal balance between resolution and measurement speed. The proposed innovations represent a novel solution for engineering inspection technology and related applications.

Key words: V-groove, 3D reconstruction, wafer sawing

^*E-mail address: marklin@itrc.narl.org.tw