‡V. ˆê”Ê�u‰‰�iƒ|ƒXƒ^�[�jƒvƒ�ƒOƒ‰ƒ€
(Contributed papers for Posters)
SiCƒoƒ‹ƒNŒ‹�»�¬’·
P1 SiCƒoƒ‹ƒN�¬’·‚É‚¨‚¯‚éŽíŒ‹�»•\–Ê�ˆ—�Œø‰Ê
(Effects of Seed Treatment on SiC Bulk Growth)
–Ø“¡‘×’j1�A–[íö1�A�¼àV�Mˆê2�A�rˆä˜a—Y2
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì�A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�j
P2 �¸‰Ø–@‚ÌSiCŒ‹�»�¬’·‚É‚¨‚¯‚錇Š×‚Ì�§Œä
(Dislocation restraint by etch back process for SiC sublimation growth)
‰Á“¡’q‹va, b�A�¬–ö’¼Ž÷a, c�A–Ø“¡‘×’ja, c�AM. Nasir Khana, b�A�¼àV�Lˆêa, b�A�rˆä˜a—Ya, b
�i’´’ᑹ“d—Í‘fŽq‹Z�pŒ¤‹†‘Ìa�A“d‘�Œ¤b�A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ïc�j
P3 �¸‰Ø–@‚É‚æ‚è�¬’·‚µ‚½�‚•iˆÊ6H-SiC‚ÌŒ‹�»•]‰¿
(Evaluation of high quality 6H-SiC crystal grown by sublimation method)
�¬–ö’¼Ž÷1,2�AŽRŒû”Ž—²1,3�A‰Á“¡’q‹v1,3�A�¼àV�Lˆê1,3�A�rˆä˜a—Y1,3
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì1�AFED2�AETL3�j
P4 �¸‰Ø–@‚Å�ì�»‚µ‚½2ƒCƒ“ƒ`SiCƒEƒFƒn‚ÌŒ‹�»�«•]‰¿
(Characterization of 2 inches SiC wafer by sublimation method)
�²�X–Ø�@�M�A‰–Œ©�@�O�A�¼–ì–Î�O
�i‹ž“s�HŒ|‘@ˆÛ‘åŠw�j
P5 SiC‚̃|ƒŠƒ^ƒCƒv�§Œä‚É‚æ‚é2ƒCƒ“ƒ`ƒÓ4HŒ^’á’ï�RŠî”‚̊J”
(SiC polytype control and the development of 4H type 2in wafer with low resistivity)
’†ŽR�_“ñ*�AŽO–ö—mˆê*�A�‚“c’õ‰î*�A‰–Œ©�@�O*�A�¼–ì–Î�O**
�iƒVƒNƒXƒIƒ“*�A‹ž“s�HŒ|‘@ˆÛ‘åŠw**�j
P6 SiC‚Ì“±“d�«�§Œä‚É‚æ‚é2ƒCƒ“ƒ`ƒÓ6HŒ^’á’ï�R‚¨‚æ‚Ñ�‚’ï�RŠî”‚̊J”
(6H type, 2 inch SiC wafer with low and high-resistivity by the conductivity control)
ŽO–ö—mˆê*�A’†ŽR�_“ñ*�A�‚“c’õ‰î*�A‰–Œ©�@�O*�A�¼–ì–Î�O**
�iƒVƒNƒXƒIƒ“*�A‹ž“s�HŒ|‘@ˆÛ‘åŠw**�j
P7 �‚‰·‹Ç�Љt‘Š�¬’·–@‚ð—p‚¢‚½6H-SiC’PŒ‹�»�¬’·
(High temperature local LPE growth of 6H-SiC)
�ó‰ª�@�N�A•½–{‰ë�M*,’J–ì‹g–í*,ŽR“c‰vŽO*,ŠÝ“c�º•F,�²–ì’¼�Ž,‹àŽq’‰�º
�iŠÖ�¼Šw‰@‘åŠw�A*“ú–{ƒsƒ‰�[�H‹Æ�j
SiCƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·
P8 Si (001)Šî”Â�ã‚Ö‚Ì‘å–Ê�Ï3C-SiCƒwƒeƒ�ƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·�|3C-SiC‚ÌŒ‹�»•]‰¿�|
(Large area 3C-SiC hetero-epitaxial growth on Si (001) substrate. -Evaluation of 3C-SiC crystal defects-)
‰ÍŒ´�FŒõ�A”ª–Ø–M–¾�A’·àV�O�K
�iHOYA�j
P9 ‹C‘Š�¬’·‚É‚¨‚¯‚éƒ}ƒCƒNƒ�ƒpƒCƒv•Â�ǂ̉ð�Í
(Analysis of micropipe closing via 4H-SiC vaporphase epitaxy)
Š™“cŒ÷•ä�A“y“c�Gˆê�A’¼–{�@•Û�A�ò�@–M˜a
�i“d—Í’†‰›Œ¤‹†�Š�j
P10 DMS‚ð—p‚¢‚½SiCƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·‚Ì�‰Šú‰ß’ö
(Initial stage of SiC epitaxial growth using dimethylsilane.)
�¬“c�@�Ž�AˆÀˆäаޡ�A�Ô‰H�³Žu
�i’·‰ª‹Z�p‰ÈŠw‘åŠw�j
P11 ‰ž—͊ɘa‹@�\‚ðŽ�‚ƒVƒŠƒRƒ“Šî”Â�ã‚Ö‚Ì3C-SiCŒ‹�»�¬’·
(Growth of 3C-SiC Layers on Silicon Substrates with a Novel Stress Relaxation Structure)
�F�ì–F�G�AŽR“c�@“o�AŽ÷�_‰ë�l�A‰Á’n�@“O
�i–L“c’†‰›Œ¤‹†�Š�j
P12 —L‹@ƒVƒ‰ƒ“–@‚É‚æ‚éSiC/SiŠE–ʃoƒbƒtƒ@‘w‚ÌŒ`�¬
(Formation of the interfacial buffer layer by organo-silane method)
’†àV“ú�oŽ÷�A––ŒõáÁŠó
�i“Œ–k‘åŠw�j
P13 ’ᑬƒCƒIƒ“ƒr�[ƒ€‚É‚æ‚éSi (100)’Y‰»”½‰ž
(Carbonization process of a Si (100) surface using low-velocity ion beams)
’Ø“à�M‹P�A’ƒ’JŒ´�º‹`�A–ؖ쑺�~�A–x–ì—TŽ¡
�i�H‹Æ‹Z�p‰@‘å�ã�H‹Æ‹Z�pŒ¤‹†�Š�j
P14 ”M�ˆ—�‚É‚æ‚é’Y‰»‘w‚ÌSiC‰»Œ»�Û
(Transformation of Carbon layer into SiC under Annealing Condition)
‰œ–ì‰pˆê�A“V–ì�LŽ¡
�iƒfƒ“ƒ\�[�j
P15 ‘å“d—¬–§“xƒCƒIƒ“’�“ü‚É‚æ‚é–„‚ß�ž‚ÝSiC‘w‚ÌŒ`�¬
(Buried SiC layer formation by high current density ion implantation)
�¼“‡Œ’Žj�A‘]‰ä•”Œ“Žj�AˆÀ•”Œ÷“ñ�A�]—´�@�C�A’†“ˆŒ˜Žu˜Y
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P16 —L‹@Œ]‘f‰»�‡•¨‚ð—p‚¢‚½SiŠî”Â�ã‚Ö‚Ì3C-SiC”––Œ�¬’·‚¨‚æ‚Ñ•]‰¿
(Growth and estimation of 3C-SiC film on Si substrate using Si2(CH3)6 )
ˆÉŠÖ�@‹B�A“¡‰ª—mˆê�A�󌩒¼‰›�A•ÄˆäŒ’Ž¡
�iŽÅ‰Y�H‹Æ‘åŠw�j
P17 Si(001)Šî”Â�ã3C-SiCƒwƒeƒ�ƒGƒs–Œ‚ÌAPD�Áޏ‹@�\(2)�@�|’Y‰»–Œ‚ÌŒø‰Ê�|
(The APD annihilation mechanism of 3C-SiC hetero-epilayer on Si(001) substrate (II)
-The effect of carbonized layer-)
�Γc—[‹N�A�‚‹´“O•v�A‰œ‘º�@Œ³�A‹g“c’åŽj*
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�A�é‹Ê‘åŠw*�j
P18 3C-SiCƒwƒeƒ�ƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·‚É‚¨‚¯‚é�¬’·�‰Šú‰ß’ö‚̉e‹¿
(Effect Early Stage of Growth in Heteroepitaxial Growth of 3C-SiC on Si)
�‚‹´“O•v�A‰ª�@‘ñ–�*�A�Γc—[‹N�A‰œ‘º�@Œ³�A‹g“c’åŽj**�A�rˆä˜a—Y
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�A“ú–{‘åŠw*�A�é‹Ê‘åŠw**�j
P19 ƒ¿-SiC’PŒ‹�»Šî”Â�ã‚ł̃À-SiC‘½Œ‹�»‚©‚ç‚̃¿-SiC’PŒ‹�»‚̌őŠ�¬’·
(Solid phase epitaxial growth of ƒ¿-SiC from poly-Crystalline ƒÀ-SiC on ƒ¿-SiC Seed substrate)
’J–ì‹g–í�A•½–{‰ë�M�A’JŠ_‹P”V�A˜a“cŒ\Ži�A‘O“c—˜‹v�AŽR“c‰vŽO
�i“ú–{ƒsƒ‰�[�H‹Æ�j
P20 15R-SiC (000_1)C–ʂ̃Gƒbƒ`ƒsƒbƒgŠÏŽ@
(Observation of etch pits on 15R-SiC (000_1) C-face)
�¼Œû‘¾˜Y�A�´�…—˜”V�A�²�X–Ø�M�A‘å�ê�@Œå�A�¼–ì–Î�O
�i‹ž“s�HŒ|‘@ˆÛ‘åŠw�j
P21 6H-SiC�ã‚É15R-SiC‚ª”�¶‚·‚éƒ�ƒJƒjƒYƒ€‚Ì�lŽ@
(Study of 15R-SiC growth mechanism on 6H-SiC)
�¬ŒI‰p”ü�AœA�£•x�²—Y�A�¼ˆä�FŽj�A ‰i‹v•Û‰ë•v�A ‰¶“c�³ˆê
�iƒfƒ“ƒ\�[�j
P22 <1-100>‹y‚Ñ<11-20>•ûŒü‚ɃIƒt‚µ‚½4H-SiCŠî”‚ւÌCVD�¬’·
(CVD growth of 4H-SiC inclined towards <1-100> and <11-20>)
‘�“c‘׈ê�A‘å�ê�@Œå�AChacko Jacob�A�¼–ì–Î�O
�i‹ž“s�HŒ|‘@ˆÛ‘åŠw�j
P23 (11_20)–Ê�ã‚Ö‚ÌpŒ^4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·‚Æ‚»‚Ì•]‰¿
(Growth and characterization of p-type 4H-SiC epitaxial layer on (11_20) face)
Ž™“‡ˆê‘�1,2�A‘å–ì�r”V1,3�A‹ù•”Œõ�O1,3�A�¹Œ´�@èM1,3�A�Γc—[‹N1,2�A�‚‹´“O•v1,2�A—é–Ø—_–ç1,3�A
‹g“c’åŽj1,2�A“c’†’m�s1,3�A�rˆä˜a—Y1,2
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3�j
P24 Epitaxial growth of SiC in hydrogen atmosphere by sublimation close
space technique
T.Furusho, S.K.Lilov*, S.Ohshima and S.Nishino
�iKyoto institute of teclmology, *University of Sofia:Bulgaria�j
P25 ’áƒIƒtŠp4H-SiC (0001)Šî”Â�ãƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·‚Ì•\–ʃ‚ƒtƒHƒ�ƒW�[�§Œä
(Control of Surface Morphologies for Epitaxial Growth on Low Off-Angle 4H-SiC (0001)
Substrates)
�¹Œ´�@èM1�A‹ù•”Œõ�O1�AŽ™“‡ˆê‘�‚P�A‘å–ì�r”V1�A�Γc—[‹N2�A�‚‹´“O•v2�A—é–Ø—_–ç1�A
“c’†’m�s1�A‹g“c’åŽj2�A�rˆä˜a—Y2
�i�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�j
P26 4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·–Œ‚Ì”½ŽË‡]�üƒgƒ|ƒOƒ‰ƒtŠÏŽ@
(Reflection X-ray topograph observation of 4H-SiC epitaxial films)
‘å–ì�r”V1,2�AŽRŒû”Ž—²1,3�A‹ù•”Œõ�O1,2�A�¹Œ´�@èM1,2�AŽ™“‡ˆê‘�1,3�A�‚‹´“O•v1,3�A�Γc—[‹N1,3�A
—é–Ø—_–ç1,2�A‹g“c’åŽj1,3�A�rˆä˜a—Y1,3
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì1 �A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï2�A“dŽq‹Z�p‘��‡Œ¤‹†�Š3�j
P27 SiC�¸‰Ø–@‚É‚¨‚¯‚é’‚‘f‚ÌŽæ�ž‚Ý‹@�\‚ɂ‚¢‚Ä‚Ì�lŽ@
(Study on Mechanism of Nitrogen Incorporation in Sublimation Growth of SiC)
“à“¡�³”ü�AŒ´�@ˆê“s, œA�£•x�²—Y�A‰¶“c�³ˆê
�iƒfƒ“ƒ\�[�j
P28 a-SiC‚̃vƒ‰ƒYƒ}CVD‰ß’ö‚É‚¨‚¯‚é�¬’·ƒJƒCƒlƒeƒBƒNƒX‚Æ–Œ‚Ì�ÔŠO‹zŽû•ªŒõ“Á�«
(Growth kinetics of a-SiC on RF plasma-enhanced CVD and FT-IR analysis of the film)
‹àŽq�@ãà�A‹{�ì�é–¾�A”Ñ�ì—T–ç
�i“Œ‹ž—�‰È‘åŠw�j
P29 �cŒ^ƒzƒbƒgƒEƒH�[ƒ‹CVD‚É‚æ‚éSiC‚Ì�‚‘¬�¬’·
(High-speed growth of SiC by vertical hot-wall CVD)
“¡•½ŒiŽq�A“c‘º’®”V�A–Ø–{�P’¨�A�¼”g�O”V
�i‹ž“s‘åŠw�j
P30 4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹’PŒ‹�»‚ÌŒú–Œ‰»
(Growth of thick 4H-SiC epitaxial layers)
“y“c�Gˆê�CŠ™“cŒ÷•ä�C’¼–{�@•Û�C�ò�@–M˜a
�i“d—Í’†‰›Œ¤‹†�Š�j
P31 First 5x3"/7x2" Hot-Wall Planetary Reactor for the CVD Growth of Large Area SiC
Frank Wischmeyer(1)�CJohannes Kappeler(2)�CRune Berge(1)�CJan-Olov Fomell(1)�C
Holger Jurgensen(2)
�i(1)EPIGRESS AB:SWEDEN, (2)AIXTRON AG:GERMANY�j
P32 ‰¡Œ^ƒzƒbƒgƒEƒH�[ƒ‹CVD˜F‚ð—p‚¢‚½4H-SiC‚̃Gƒsƒ^ƒLƒVƒƒƒ‹�¬’·
(Epitaxial growth of 4H-SiC by using Horizontal Hot-Wall type CVD Reactor)
‹ù•”Œõ�O1,3�A�¹Œ´�@èM1,3�AŽ™“‡ˆê‘�1,2�A‘å–ì�r”V1,3�A�Γc—[‹N1,2�A�‚‹´“O•v1,2�A—é–Ø—_–ç1,3�A
‹g“c’åŽj1,2�A“c’†’m�s1,3�A�rˆä˜a—Y1,2
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3�j
P33 ‰¡Œ^ƒR�[ƒ‹ƒhƒEƒH�[ƒ‹CVD‚É‚æ‚郿-SiC�‚‘¬ƒzƒ‚ƒGƒsƒ^ƒLƒVƒƒƒ‹�¬’·‘w‚Ì•¨�«•]‰¿
(Characterization of ƒ¿-SiC epilayers grown by horizontal cold-wall CVD at high growth rates)
’†‘º�rˆê�A–Ø–{�P’¨�A�¼”g�O”V
�i‹ž“s‘åŠw�j
SiC•¨�«•]‰¿
P34 3C-SiC/Siƒwƒeƒ�ƒGƒsƒ^ƒLƒVƒƒƒ‹–Œ‚̃‰ƒ}ƒ“ŽU—�•]‰¿
(Characterization of 3C-SiC Heteroepitaxial Films by Raman scattering)
’†“‡�Mˆê*�A’†•�‘׌[*�A”d–��@�O**
�i*‹{�è‘åŠw�A**‘å�ã‘åŠw�j
P35 ƒ‰ƒ}ƒ“ŽU—�‚É‚æ‚éSiC-Ni“d‹É”½‰ž‚ÌŒ¤‹†
(Raman Study on the SiC-Ni electrode Reaction)
ŒI–{‰pŽ¡1�A”d–��@�O1�A’†“‡�Mˆê2�AŠâŒ©Šî�O3�AŒË“c’‰•v4�AàV“c�@–«4
�i‘å�ã‘åŠw1�A‹{�è‘åŠw2�A‰ªŽR‘åŠw3�AŽO—m“d‹@4�j
P36 ƒ‰ƒ}ƒ“ŽU—�‚É‚æ‚é3C-SiCƒzƒ‚ƒGƒsƒ^ƒLƒVƒƒƒ‹–Œ‚Ì�Ï‘wŒ‡Š×‚Ì•]‰¿
(Raman Scattering Characterization of Stacking Faults in 3C-SiC Homo-Epitaxial Films)
’†•�‘׌[*�A’†“‡�Mˆê*�A�Γc—[‹N**�A“y“c�Gˆê***
�i*‹{�è‘åŠw�A**“dŽq‹Z�p‘��‡Œ¤‹†�Š�A***“d—Í’†‰›Œ¤‹†�Š�j
P37 SiC�´�ò•\–Ê‚Ì�\‘¢
(Structures of Clean SiC Surfaces)
‹v“c�Ë”V�A�ÂŽR•ü�O*�AŠØ�@‹Êž^*�AŒü’†–ì�Mˆê�A’·’J�쌒�Aˆê‹{•V•F*
�iƒfƒ“ƒ\�[�A*–¼ŒÃ‰®‘åŠw�j
P38 nŒ^6H-SiC(0001) just face�ã‚ÌSi–Ê‹y‚ÑC–ʂ̕\–Ê�\‘¢�|ƒGƒbƒ`ƒ“ƒO�EŒ¤–�ƒvƒ�ƒZƒXˆË‘¶�«�|
(Surface structure on Si and C face of n type 6H-SiC(0001) just face -dependence of etching and polishing processes-)
�´�…”Ž‹I�A‹´–{�@Œ’�AˆÀ•”Œ÷“ñ�A�]—´�@�C�A’†“ˆŒ˜Žu˜Y
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P39 4H-SiC�ã‚Ì“ñ‘w�\‘¢Ž_‰»–Œ‚ÌŒø‰Ê
(Optimizing annealing process for double oxide layers on 4H-SiC)
‹àŽq�²ˆê˜Y�A‹Ë’J”Í•F�A’J–{�@’q�AŽR’†�@�Ó�A�¯�@�³�Ÿ
�i“úŽYŽ©“®ŽÔ�j
P40 SiC•\–Ê�ˆ—��iŽ_‰»�C�…‘f”M�ˆ—��j‰ß’ö‚Ì‚»‚Ì�ꕪ�Í
(In-situ analysis of thermal oxidation and hydrogen annealing on SiC surface)
’¼–{�@•Û�C“y“c�Gˆê�CŠ™“cŒ÷•ä�C�ò�@–M˜a
�i“d—Í’†‰›Œ¤‹†�Š�j
P41 —z‹ÉŽ_‰»–@‚É‚æ‚é6H-SiC�ã•\–Ê‘w‚Ì‹]�µŽ_‰»
(Sacrificial oxidation of 6H-SiC by the anodic oxidation method)
‰Á“¡�³Žj�AŽs‘º�³–ç�A�rˆä‰p•ã
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P42 O2ƒvƒ‰ƒYƒ}‚É‚æ‚éSiCŽ_‰»–Œ‚̒ቷŒ`�¬(2)
(Low temperature formation of SiC Oxide Films by O2 plasma (2)
“‡“c‹v‹L�A–öŒ´�²’mŽq�A’†‘º’q�é�A�²“¡��F
�i–@�‘åŠw�j
P43 4H-�A6H-SiC‚É‚¨‚¯‚é‹ó�EƒNƒ‰ƒXƒ^�[‚ÌESR‚É‚æ‚錤‹†
(ESR study on vacancy clusters in 4H- and 6H-SiC)
�…—ŽŒ›˜a1,2�Aˆé’J�‡ˆê1,2�A ŽR�è�@‘�2�A‘ëàV�tŠì3�A�X‰ºŒ›—Y3�A‘哇�@•�3�AˆÉ“¡‹v‹`3
�i�}�î‘å1�AJRCAT-—Z�‡Œ¤2�AŒ´Œ¤�‚�è3�j
P44 ƒpƒ‹ƒXƒŒ�[ƒU�[ƒAƒj�|ƒŠƒ“ƒO‚É‚æ‚éƒCƒIƒ“’�“üSiC‚ÌŒ‹�»�«‰ñ•œ
(Recrystalization of ion implanted SiC by pulsed laser annealing)
�ÂŽRŒõ‘¾˜Y�A�…“c�¬‘¥�AˆÀ•”Œ÷“ñ�A�]—´�@�C�A’†“ˆŒ˜Žu˜Y
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P45 3C-SiC’†‚ÌŒ‡Š×‚ɑ΂·‚é�…‘fƒvƒ‰ƒYƒ}�ˆ—�‚̉e‹¿
(Effect of hydrogen-plasma treatment on defects in 3C-SiC)
1‘c•ƒ�]•¶�F�A1‰Á“¡�³Žj�A1Žs‘º�³–ç�A1�rˆä‰p•ã�A2ŽR“c�@“o�A3“¿“c�@–L�A4‰œ‘ºŽŸ“¿
�i1–¼ŒÃ‰®�H‹Æ‘åŠw�A2–L“c’†‰›Œ¤‹†�Š�A3ˆ¤’m�H‹Æ‘åŠw�A4“Œ‹ž“s—§‘åŠw�j
P46 SiCƒGƒs‘w�|ƒoƒ‹ƒNŠE–ʂɑ¶�Ý‚·‚é�[‚¢�€ˆÊ‚Ì“™‰·‰ß“n—e—Ê•ªŒõ–@‚É‚æ‚鑪’è�B
(Observation of deep levels at interface of epitaxial SiC and bulk SiC by use of isothermal capacitance transient spectroscopy)
“¡Šª�@�^1,2�A‹ù•”Œõ�O1,3�A�¹Œ´èM1,3�AŽ™“‡ˆê‘�1,2�AŽlŒË�F1,3�A‘勸�G�¢1,2�A�rˆä˜a—Y1,2
�i’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�A�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3�j
P47 •ªŒõƒGƒŠƒvƒ\ƒ��[ƒ^�[‚É‚æ‚éSiCŽ_‰»–Œ‚Ì‹ü�Ü—¦‚Ì•]‰¿
(Characterization of refractive index profile of oxide films on SiC by spectroscopic ellipsometer)
”Ñ“cŒ’*1�A•x‰ª—Yˆê*1�A’Ë“c�_”V*1�A—Î�ì�³•F*1�A‹g–{˜a�¶*1�A“y•û‘דl*1�A–îŒû—T”V*1�A
‹g�ì�³�l*2�A�Γc—[‹N*3�A‹g“c’åŽj*1*3
�i*1�é‹Ê‘åŠw�A*2“ú–{Œ´Žq—ÍŒ¤‹†�Š�A*3“dŽq‹Z�p‘��‡Œ¤‹†�Š�j
P48 6H-SiC(00�E1)ƒIƒtŠî”‚ɂ¨‚¯‚éƒ}ƒCƒNƒ�ƒpƒCƒvŽü•Ó‚ÌŒõ’e�«ƒpƒ^�[ƒ“
(Pbotoelastic Pattern around the Micropipe with Off-Angled�i00�E1�j6H-SiC Substrates
‘å—¢�@êŽ�A˜a“cŒ«‰î
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P49 �‚‰·‚É‚¨‚¯‚éSiC‚Ì•ªŒõƒGƒŠƒvƒ\ƒ�ƒgƒŠ�[
(Spectroscopic ellipsometry of SiC at high temperature�j
‹v•Û’¼‹I�AŽR“c�‚а�A�X’J–¾�O�A�Ÿ–ì�³˜a�–�A‘å’J�@�¸�–
�i“‡�ª‘åŠw�A�V“ú–{�»èc�–�j
P50 SiO2/nŒ^SiC(11-20)‚É‚¨‚¯‚é�󂢊E–Ê�€ˆÊ
(Shallow States at SiO2/n-type SiC(11_20) Interface)
–î–ì—TŽi�A–Ø–{�P’¨�A�¼”g�O”V
�i‹ž“s‘åŠw�j
P51 6H-SiC‚É‚¨‚¯‚鎩—R“dŽq‚Ì“`“±‘ÑŠÔ’´�‚‘¬ŠÉ˜a‰ß’ö
(Ultrafast inter-conduction-band electron relaxation processes in 6H-SiC)
•x“c‘ì˜N1�AâV“¡�LŒá1�A––Œ³�@“O1�A”d–��@�O2�A’†“‡�Mˆê3
�i“Œ‹ž‘åŠw1�A‘å�ã‘åŠw2�A‹{�è‘åŠw3�j
P52 ‘–�¸ƒI�[ƒWƒF•ªŒõ–@‚É‚æ‚éSiO2/SiCŠE–ʂ̑g�¬•ª�Í
(Composition Analysis of SiO2/SiC Interface by Scanning Auger Electron Spectroscopy)
“y•û‘דl�A”Ñ“c�@Œ’�A–îŒû—T”V�A‹g�ì�³�l*�A‹g“c’åŽj
�i�é‹Ê‘åŠw�A*“ú–{Œ´Žq—ÍŒ¤‹†�Š�j
P53 �[އŠOƒŒ�[ƒU�[—ã‹NPL‚É‚æ‚é4H SiC ƒGƒsƒEƒGƒn�[‚Ì•]‰¿
(Characterization of SiC Epitaxial Wafers by PL under Deep UV Excitation)
“c’†Œõ”Ža,b�A“c“‡“¹•va�A�²–ì‰ë•qb
�ia‰F’ˆ‰ÈŠwŒ¤‹†�Š�Ab“Œ‹ž—�‰È‘åŠw�j
P54 Cu/3C-SiC�Ú�‡Œn‚ÌŠE–Ê”½‰ž‹y‚Ñ�¶�¬•¨‚̉¿“dŽq‘Ñ�\‘¢
(Study of the reaction at Cu/3C-SiC interface and valence-band electronic structure of the reaction product)
ˆÀ�U˜A�A•½ˆä�³–¾�A“ú‰º�ª•F�AŠâ”üŠî�O
�i‰ªŽR‘åŠw�j
SiCƒfƒoƒCƒX�Eƒvƒ�ƒZƒX
P55 Cu/ ƒ¿-SiC�Ú�‡ƒVƒ‡ƒbƒgƒL�[�á•Ç�‚‚³�§Œä
(Control of Schottky Barrier Height in Cu/ ƒ¿-SiC Junctions)
�ì�l˜a–¾�AŽO�ã‰p‘¥�A‹M“‡—mŽj�A”¨ŽR’q—º�A‰Y‰ª�sŽ¡�A“~–Ø�@—²
�i“Þ—Ç�æ’[‰ÈŠw‹Z�p‘åŠw‰@‘åŠw�j
P56 ƒGƒLƒVƒ}ƒŒ�[ƒU�[�Ǝ˂ɂæ‚éSiC‚Ö‚ÌCuƒI�[ƒ~ƒbƒN“d‹É‚ÌŒ`�¬
(Copper ohmic contacts to SiC fabricated with pulsed excimer laser irradiation)
ˆÀ•”Œ÷“ñ�A�Z—F�³�´�A�]—´�@�C�A’†“ˆŒ˜Žu˜Y
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P57 Žº‰·Œ`�¬‚µ‚½Al/nŒ^4H-SiC’á’ï�RƒI�[ƒ~ƒbƒNƒRƒ“ƒ^ƒNƒg
(Low ohmic contact resistance of Al/n-type 4H-SiC contacts processed at room temperature)
‘�Œ©‘×–¾1,3�A’J–{�@’q1,3�A�¯�@�³�Ÿ1,3�A‘勸�G�¢2,3
�i�V‹@”\‘fŽqŠJ”‹¦‰ï1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�A’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì3�j
P58 1/f“d—¬ŽG‰¹‘ª’è‚É‚æ‚é4H-SiC‚̃I�[ƒ~ƒbƒN“d‹É‚Ì•]‰¿
(Characterization of Ohmic Contact for 4H-SiC by 1/f Current Noise Measurement)
“c�À�L‹v�A‰¡‘qŽO˜Y�AŒÜ�\—’“o�A‘é–ì’v˜a
�i–¾�¯‘åŠw�j
P59 ƒRƒ“ƒ^ƒNƒgŒ`�¬‚ÉRIE‚ðŽg—p‚µ‚½ƒI�[ƒ~ƒbƒN“d‹É‚Ì“Á�«
(Characteristics of ohmic contact after reactive ion etching)
�™–ì�@Šw�A�¯�@�³�Ÿ�A’J–{�@’q�AŽR’†�@�v
�i“úŽYŽ©“®ŽÔ�j
P60 6H-SiC‚Ö‚ÌTaSi2ƒI�[ƒ~ƒbƒN“d‹É‚Ì�ì�»
(Fabrication of TaSi2 ohmic contacts for 6H-SiC)
‹g“c˜a�O1)�A‹g“c�@�O1)�A‰œŽR�N�¶2)�AˆÀ•”Œ÷“ñ1)�A�]—´�@�C1)�A’†“ˆŒ˜Žu˜Y1)
�i1)–¼ŒÃ‰®�H‹Æ‘åŠw�A2)“ú–{“ÁŽê“©‹Æ�j
P61 Formation of silicides and carbides in Ti(film)/4H-SiC(000�|1)(substrate) system
J. Labis, A. Ohi, T. Fujiki, M. Hirai, M. Kusaka, and M. Iwami
�iOkayama Univ.�j
P62 N2�{ƒCƒIƒ“’�“ü6H-SiC‚Ì”M�ˆ—�“Á�«
(Annealing characteristics of N2+-ion implantation in 6H-SiC)
Šâ“c�@‘å�A�™ŽRŒúŽu�Aˆî“c‘¾˜Y
�i–@�‘åŠw�j
P63 �‚‰·ƒCƒIƒ“’�“ü‚É‚æ‚éSiC-MESFETƒ\�[ƒX’ï�R‚̒ጸ
(Source resistance reduction by hot ion implantation in SiC-MESFET)
‘ò�è�_Žj�A ”öŒ`�@�½�A –{“c�O‹B�A �¬–ì �Cˆê�A �Vˆä�@Šw�A –k‘º�¹—Ç
�i�V“ú–{–³�ü�j
P64 AlƒCƒIƒ“’�“ü‚ð�s‚Á‚½4H-SiC‚Ì“d‹C“Á�«
(Electrical characteristics of Aluminum ion implanted 4H-SiC)
“c’†�G–¾�A�™–ì�@Šw�A’J–{�@’q�AŽR’†�@�v�A�¯�@�³�Ÿ
�i“úŽYŽ©“®ŽÔ�j
P65 As+’�“ü4H-SiC‚Ì’�“ü‘w�ÄŒ‹�»‰»‰ß’ö
(Recrystallization Process for As+ Implanted Layers into 4H-SiC)
�æí•�ƒŽõ1,2�A‘å–ì�r”V1,3�A�¬�™—ºŽ¡1,2�AŒ´“c�M‰î1,2�A—é–Ø�½“ñ1,3�A•Ÿ“cŒ›Ži1,2�A�rˆä˜a—Y1,2
�i’´’á‘¹Ž¸“d—Í‘fŽqŒ¤‹†‘Ì1�A“dŽq‹Z�p‘��‡Œ¤‹†�Š2�A�V‹@”\‘fŽqŠJ”‹¦‰ï3�j
P66 ƒCƒIƒ“’�“ü–@‚É‚æ‚è�ì�¬‚µ‚½Er“Y‰Á‚SH-SiC‚Ì”Œõ
(Photoluminescence from Er-implanted 4H-SiC)
Œã“¡‹M”V�A�A‘��Vˆê˜Y
�i–¾Ž¡‘åŠw�j
P67 pn�Ú�‡‚ð—p‚¢‚½SiC�‚‰·“®�ìƒKƒXƒZƒ“ƒT
(SiC pn-junction Diode Type Gas Sensor for High Temperature Applications)
‰œŽR�N�¶1)�AˆÀ“¡�ËŽq2)�A–ì–{˜a�º2)�A‰¡ˆä“™1)�A‘哇�’•¶1)�AˆÀ•”Œ÷“ñ2)�A�]—´�@�C2)�A
’†“ˆŒ˜Žu˜Y2)
�i1�j“ú–{“ÁŽê“©‹Æ�A2)–¼ŒÃ‰®�H‹Æ‘åŠw�j
P68 ƒfƒ‹ƒ^ƒh�[ƒv�\‘¢ƒAƒLƒ…ƒ~ƒ…ƒŒ�[ƒVƒ‡ƒ“ƒ`ƒƒƒ“ƒlƒ‹‚ð—p‚¢‚½4H-SiC MOS-FET
(4H-SiC MOS-FET with delta-doped accumulation-channel)
‰¡�ì�r�Æ�A�‚‹´–M•û�A“í–{�@�C�A“à“c�³—Y�A–k”©�@�^
�i�¼‰º“dŠíŽY‹Æ�j
P69 6H-SiCƒfƒ‹ƒ^ƒh�[ƒv�\‘¢‚Ì“dŽq—A‘—“Á�«‚ÆMES-FET‚ւ̉ž—p
(Electronic transport of 6H-SiC delta-doped structure and its application for FET)
‰¡�ì�r�Æ�A�‚‹´–M•û�A“í–{�@�C�A“à“c�³—Y�A–k”©�@�^
�i�¼‰º“dŠíŽY‹Æ�j
P70 Effect of off-angle from Si (0001) face on SiO2/SiC interface properties
of SiC MOS structures
K. Fukuda1, S. Suzuki2, J. Senzaki1, R. Kosugi1, S. Harada1, T. Tanaka2, and K. Arai1
�i1UPR Electrotechnical Laboratory, 2UPR R & D Association for Future Electron Devices�j
P71 ‚SH-SiC MOSŠE–Ê‚ÆMOSFET“Á�«‚Ì‘ŠŠÖ
(Relationships between 4H-SiC MOS interface and MOSFET properties)
—é–Ø�½“ñ1�AŒ´“c�M‰î2�A�æí•�ƒŽõ2�A�¬�™—ºŽ¡2�A•Ÿ“cŒ›Ži2�A“c’†’m�s1�A�rˆä˜a—Y2
�i1UPR/�V‹@”\‘fŽqŠJ”‹¦‰ï�A2UPR/“dŽq‹Z�p‘��‡Œ¤‹†�Š�j
P72 4H-‚¨‚æ‚Ñ6H-SiC MOSFETs ‚̉·“xˆË‘¶�«
(Temperature dependence of 4H- and 6H-SiC MOSFETs)
Œ´“c�M‰î1),2)�A�¬�™—ºŽ¡1),2)�A�æ�è�ƒŽõ1),2)�A—é–Ø�½“ñ1),3)�A•Ÿ“cŒ›Ži1),2)�A�rˆä˜a—Y1),2)
�i1�j ’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì�A2�j“dŽq‹Z�p‘��‡Œ¤‹†�Š�A3�j�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï�j
P73 LTOƒQ�[ƒg�â‰�–Œ4H-SiC MOSŠE–Ê“Á�«
(Interfacial characteristics of LTO/4H-SiC MOS capacitor)
�¬�™—ºŽ¡1, 2�AæâŒ³Žì1, 2�A—é–Ø�½“ñ2, 3�A�æ�è�ƒŽõ1, 2�AŒ´“c�M‰î1, 2�A•Ÿ“cŒ›Ži1, 2�A�rˆä˜a—Y1, 2
�i1“dŽq‹Z�p‘��‡Œ¤‹†�Š�A2’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì�A3�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï�j
P74 Effect of activation annealing time on the micro-structural and electrical
properties of Al implanted 4H-SiC
Rajesh Kumar Malhan and Hiroki Nakamura
�iDENSO�j
P75 ‚SH-SiCƒVƒ‡ƒbƒgƒL�[ƒ_ƒCƒI�[ƒh‚̑ψ³�\‘¢‚ÌŒŸ“¢
(Edge Termination of 4H-SiC SBD)
“¡àV�L�K�A’Ò�@�’�A‰¬–ì�TŽŸ�A“y“c�Gˆê�–�AŠ™“cŒ÷•ä�–�A’¼–{�@•Û�–�A�ò�@–M˜a�–
�i•xŽm“d‹@‘��‡Œ¤‹†�Š�A“d—Í’†‰›Œ¤‹†�Š�–�j
P76 ‘–�¸Œ^ƒLƒƒƒpƒVƒ^ƒ“ƒX‘ª’è–@‚É‚æ‚éSiC�Ú�‡Œ`�ó•]‰¿
(Analysis of SiC junction profile analysis by the scanning capacitance measurement)
�¬–ì�£�G�Ÿ�A“n•Ó“Ä—Y�A‰¡“c•�Ži�A�Î�ì�@“§�A�õ’J—F�K�AŽO•r�@—E�A”ª”ö�@•×�A�¬—Ñ�@—T
�i“ú—§�»�ì�Š�j
P77 4H-SiCƒVƒ‡ƒbƒgƒL�[ƒoƒŠƒAƒ_ƒCƒI�[ƒh‚Ì‹t•ûŒü“Á�«‰ð�Í
(Reverse Characteristics of 4H-SiC Schottky Barrier Diode)
”©ŽR“N•v�A�¡ˆä�¹Žx�AŽlŒË�@�F
�i1�j’´’á‘¹Ž¸“d—Í‘fŽq‹Z�pŒ¤‹†‘Ì�A2)�V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï�j
P78 ƒQ�[ƒgŽ_‰»–Œ�…�ö‹C�ˆ—�‚µ‚½6H-SiC MOSFET‚̃Kƒ“ƒ}�ü�Ǝ˂ɂæ‚é“Á�«•ω»
(Influence of gamma-ray irradiation on the characteristics of 6H-SiC MOSFET with steam-annealed gate oxide)
‘哇�@•��AˆÉ“¡‹v‹`�A‹g�ì�³�l
�i“ú–{Œ´Žq—ÍŒ¤‹†�Š�j
P79 Ž_‘fƒCƒIƒ“’�“üƒVƒŠƒRƒ“ƒJ�[ƒoƒCƒh‚É‚¨‚¯‚é–„‚ß�ž‚Ý”ñ�»Ž¿‘w‚Ì�\‘¢‰ð�Í
(Structural analysis of buried amorphous layers in oxygen-ion-implanted silicon carbide)
�ΊÛ�@Šw�A�O’Ã’õ•F
�i‘å�ã‘åŠw�j
ƒ_ƒCƒ„ƒ‚ƒ“ƒh‚¨‚æ‚ÑŽ_‰»•¨
P80 ‹à‘®�^CVDƒ_ƒCƒ„ƒ‚ƒ“ƒh”––Œ‚Ì�Ú�‡“Á�«
(Junction Properties of Metal/CVD Diamond Films)
ŽR’†’å‘¥�A’|“à‘å•ã�A‘勸‰p�¢
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�j
P81 ƒ_ƒCƒ„ƒ‚ƒ“ƒh”––Œ‚ÌŠiŽq�óŒ`�¬‚É‚æ‚éƒGƒ~ƒbƒVƒ‡ƒ“ƒTƒCƒg�”‚Ì‘�‘å
(Increase in number of emission site by embossment deposition of diamond film)
�¼�ì”NŽõ�A‘å–î�@�„�A�¯�@‘P”V�AŠâ�£–ž—Y�A˜a�ò•x—Y
�i“ŒŠC‘åŠw�j
P82 ƒŒ�[ƒU�[ƒAƒuƒŒ�[ƒVƒ‡ƒ“–@‚É‚æ‚éƒTƒtƒ@ƒCƒAŠî”Â�ã‚ւ̃Gƒsƒ^ƒLƒVƒƒƒ‹TiO2”––Œ‚Ì�ì�»‚Æ•]‰¿
(Fabrication and characterization of epitaxial TiO2 thin films on sapphire substrates by pulsed laser deposition)
ŽÂŒ´—³Ž™1)�A”ªŠª“O–ç2)�A�Z“c‘׎j2)�AŽR–{�t–ç2)�A‹{‰º“Ö–¤2)�AˆÉ“¡‹v‹`2)�A�óˆäŒ\‰î1)
�i1�j“Œ‹ž‘åŠw�A2)“ú–{Œ´Žq—ÍŒ¤‹†�Š�j
’‚‰»•¨
P83 RF-MBE‚É‚æ‚é�‚•iŽ¿AlGaN/GaNƒwƒeƒ��\‘¢‚Ì�ì�»‹y‚Ñ‚»‚Ì•]‰¿
(Fabrication and characterization of high-quality AlGaN/GaN heterostructures grown by RF-MBE)
’¾ˆ®‹�AˆäŽè—˜‰p�A�´�…ŽO‘��A‰œ‘º�@Œ³
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�j
P84 ‘I‘ðƒ}ƒXƒgƒ‰ƒ“ƒXƒ|�[ƒg‚É‚æ‚é–Ê“àGaN/AlGaNƒwƒeƒ��\‘¢‚Ì�ì�»
(In-plane GaN/AlGaN Heterostructures by Selective Mass Transport)
�Ä“¡�^ˆê�A“’�ì—m•½�A�¬›½�³–F�A�V“c�BŒá�AŠâ’J‘fŒ°�AŽRŒû‰h—Y�A“V–ì�@�_�A�Ôí•�@—E
�i–¼�é‘åŠw�j
P85 —§•û�»InGaN�A‹y‚ÑInGaN/GaN‘½�d—ÊŽqˆäŒË�\‘¢‚Ìrf-MBE�¬’·‚Æ•]‰¿
(Growth and characterization of cubic InGaN and InGaN/GaN multiple quantum wells by rf-MBE
–k‘ºŽõ˜N�A*—é–Ø�Ë�m�A�Γc—[‹N�A’¾ˆ®‹�A *’†�¼‹v�K�A**’�•ƒ�d‰p�A‰œ‘º�@Œ³
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�A*“Œ‹ž—�‰È‘åŠw�A**’}”g‘åŠw�j
P86 rf-MBE‚É‚æ‚èGa‹É�«�¬’·‚µ‚½AlGaN/GaNƒwƒeƒ��Ú�‡FET
(AlGaN/GaN Heterojunction Field Effect Transistors Using Ga-polarity Crystal grown by rf-MBE)
ˆäŽè—˜‰p*�A�´�…ŽO‘�**�A—é–Ø�@�W�A’¾ˆ®‹�A‰œ‘º�@Œ³*�A�ª–{�r—Y
�i“dŽq‹Z�p‘��‡Œ¤‹†�Š�A*–¾Ž¡‘åŠw�A**“ŒŠC‘åŠw�j
P87 ƒTƒtƒ@ƒCƒAŠî”Â�ãAlxGa1-xN‚̃Vƒ‡ƒbƒgƒL�[“Á�«
(Characteristics of Schottky barrier diodes or AlxGa1-xN on Sapphire)
‘å–ì�²�m�A�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A�â–{�@Œ÷�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P88 Schottky contacts of Ni/Au on n-GaN grown on sapphire and SiC substrates
B. J. Zhang, G. Y. Zhao, N. Nishikawa, M. Adachi, H. Ishikawa, T. Egawa, T. Jimbo,
and M. Umeno
�iNagoya Institute ofTechnology�j
P89 ”÷�¬GaNƒVƒ‡ƒbƒgƒL�[�Ú�G‚ð—p‚¢‚½“]ˆÊ‚Æ�@I-V“Á�«‚Æ‚Ì‘ŠŠÖ‚Ì•]‰¿
(The effect of dislocations to I-V characteristics of sub-ƒÊm GaN Schottky contacts)
‰–“‡ŒªŽŸ�A––Œõ“N–ç�A�¬–¸�[�«*
�iNTTƒtƒHƒgƒjƒNƒXŒ¤‹†�Š�A‹ž“s‘åŠw*�j
P90 ƒTƒtƒ@ƒCƒAŠî”Â�ãGaInN MQWƒŒ�[ƒU‚ÌŒõ—ã‹N“Á�«
(Characteristics of Optical Pumped GaInN MQW Laser Diodes on Sapphire)
ŠÝ�@’¼Šó�A�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P91 GaNŒn–Ê”ŒõƒŒ�[ƒU—pGaN/AlGaN DBR
(GaN/AlGaN DBR for GaN-based VCSEL)
’†“c�®�K�A�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P92 TiO2/SiO2—U“d‘Ì‘½‘w–Œ”½ŽË‹¾‚ð—p‚¢‚½ƒTƒtƒ@ƒCƒAŠî”Â�ãInGaN MQW LED‚Ì�‚�o—͉»
(High power InGaN MQW LEDs on sapphire substrate with TiO2/SiO2 distributed Bragg reflectors)
�Î�•–õ�_�A’†“c�®�K�A�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P93 MOCVD�¬’·’†‚É‚¨‚¯‚éSiŠî”Â�ãGaN‚̃�ƒ‹ƒgƒoƒbƒNƒGƒbƒ`ƒ“ƒO
(Meltback etching of GaN on Si substrate during the MOCVD growth)
�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P94 ƒtƒ‰ƒbƒNƒX–@‚ð—p‚¢‚½AlGaNƒoƒ‹ƒN’PŒ‹�»‚Ì�¬’·
(Growth of bulk AlGaN crystals using Na flux method)
Goundar Kamal Kishore�AˆÀˆäаޡ�A�Ô‰H�³Žu
�i’·‰ª‹Z�p‰ÈŠw‘åŠw�j
P95 Œõ�ÆŽËMOCVD–@‚É‚æ‚éGaNP�¬’·‚Æ•]‰¿
(GaNP grown by photo-assisted MOCVD and its characterization)
ˆÉ“Œ‹`—j�A‹g“c�´‹P�A�é�ì��“ñ˜Y
�iŒÃ‰Í“d‹C�H‹Æ�j
P96 GaN‚É‚¨‚¯‚éGeŠˆ�«‰»‚É‹y‚Ú‚·N/Ge“¯ŽžƒCƒIƒ“’�“ü‚ÌŒø‰Ê
(Effect of N/Ge sequential co-implantation on the Ge activation of GaN)
’†–ì—R�’�A‰Á’n�@“O
�i–L“c’†‰›Œ¤‹†�Š�j
P97 “¯Ž²Œ^’¼�Փ˃CƒIƒ“ŽU—�•ªŒõ–@‚É‚æ‚éƒEƒ‹ƒcŒ^GaN (0001)”––Œ‚Ì•\–Ê�\‘¢‰ð�Í
(Surface Structual Analysis of Wurtzite GaN (0001) Film by Coaxial Impact Collision Ion Scattering Spectroscopy)
�²Œ´�@“O�Až¸Œ´Š²‘å�AˆÀ•”Œ÷“ñ�A�]—´�@�C�A’†“ˆŒ˜Žu˜Y�A�Î�씎�N�A�]�ì�FŽu�A”~–ì�³‹`
�i–¼ŒÃ‰®�H‹Æ‘åŠw�j
P98 GaN‚É‚¨‚¯‚é—ã‹NŽq‚ÌˆÊ‘Š”j‰óŽžŠÔ‚̉·“xˆË‘¶�«
(Temperature dependence of dephasing time in GaN)
‰H“¤�kŽ¡1)�AŽ“àŽü1)�A�@“c�F”V1)�A‘«—§�@’q2)�A’�•ƒ�d‰p3)�A’†‘º�C“ñ4)
�i1�j‘�ˆî“c‘åŠw�A2)–kŠC“¹‘åŠw�A3)’}”g‘åŠw�A4)“úˆŸ‰»Šw�H‹Æ�j
P99 Siƒh�[ƒvnŒ^GaN‚É‚¨‚¯‚é‰i‘±Œõ“`“±
(Persistent photoconductivity in Si doped n-type GaN)
’†‘º’B�l�AŽ™“‡ˆê‘�*�A’¾ˆ®‹*�A‰œ‘º�@Œ³*�A–îŒû—T”V�A‹g“c’åŽj
�i�é‹Ê‘åŠw�A“dŽq‹Z�p‘��‡Œ¤‹†�Š*�j
P100 High responsivity MSM UV photodetector based on GaN with back illumination
H. JIANG, N. NAKATA, G. Y. ZHAO, H. ISHIKAWA, T. EGAWA, T. JIMBO and M. UMENO
�iNagoya Institute of Technology�j
P101 GaInN‘½�d—ÊŽqˆäŒË‚̃tƒHƒgƒ‹ƒ~ƒlƒbƒZƒ“ƒX“Á�«
(Photoluminescence study of GaInN multi-quantm-Well structures)
�X�@�³‹`�A�Î�씎�N�A�]�ì�FŽu�A�_•Û�FŽu�A‘�ˆäа“ñ�A”~–ì�³‹`
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