‡V. ˆê”Êu‰‰iƒ|ƒXƒ^[jƒvƒƒOƒ‰ƒ€
(Contributed papers for Posters)
SiCƒoƒ‹ƒNŒ‹»¬’·
P1 SiCƒoƒ‹ƒN¬’·‚É‚¨‚¯‚éŽíŒ‹»•\–ʈ—Œø‰Ê
(Effects of Seed Treatment on SiC Bulk Growth)
–Ø“¡‘×’j1A–[íö1A¼àVMˆê2Arˆä˜a—Y2
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘ÌAV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï1A“dŽq‹Zp‘‡Œ¤‹†Š2j
P2 ¸‰Ø–@‚ÌSiCŒ‹»¬’·‚É‚¨‚¯‚錇Š×‚̧Œä
(Dislocation restraint by etch back process for SiC sublimation growth)
‰Á“¡’q‹va, bA¬–ö’¼Ž÷a, cA–Ø“¡‘×’ja, cAM. Nasir Khana, bA¼àVLˆêa, bArˆä˜a—Ya, b
i’´’ᑹ“d—Í‘fŽq‹ZpŒ¤‹†‘ÌaA“d‘Œ¤bAV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ïcj
P3 ¸‰Ø–@‚É‚æ‚謒·‚µ‚½‚•iˆÊ6H-SiC‚ÌŒ‹»•]‰¿
(Evaluation of high quality 6H-SiC crystal grown by sublimation method)
¬–ö’¼Ž÷1,2AŽRŒû”Ž—²1,3A‰Á“¡’q‹v1,3A¼àVLˆê1,3Arˆä˜a—Y1,3
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì1AFED2AETL3j
P4 ¸‰Ø–@‚Å컂µ‚½2ƒCƒ“ƒ`SiCƒEƒFƒn‚ÌŒ‹»«•]‰¿
(Characterization of 2 inches SiC wafer by sublimation method)
²X–Ø@MA‰–Œ©@OA¼–ì–ÎO
i‹ž“sHŒ|‘@ˆÛ‘åŠwj
P5 SiC‚̃|ƒŠƒ^ƒCƒv§Œä‚É‚æ‚é2ƒCƒ“ƒ`ƒÓ4HŒ^’á’ïRŠî”‚̊J”
(SiC polytype control and the development of 4H type 2in wafer with low resistivity)
’†ŽR_“ñ*AŽO–ö—mˆê*A‚“c’õ‰î*A‰–Œ©@O*A¼–ì–ÎO**
iƒVƒNƒXƒIƒ“*A‹ž“sHŒ|‘@ˆÛ‘åŠw**j
P6 SiC‚Ì“±“d«§Œä‚É‚æ‚é2ƒCƒ“ƒ`ƒÓ6HŒ^’á’ïR‚¨‚æ‚Ñ‚’ïRŠî”‚̊J”
(6H type, 2 inch SiC wafer with low and high-resistivity by the conductivity control)
ŽO–ö—mˆê*A’†ŽR_“ñ*A‚“c’õ‰î*A‰–Œ©@O*A¼–ì–ÎO**
iƒVƒNƒXƒIƒ“*A‹ž“sHŒ|‘@ˆÛ‘åŠw**j
P7 ‚‰·‹ÇŠ‰t‘Š¬’·–@‚ð—p‚¢‚½6H-SiC’PŒ‹»¬’·
(High temperature local LPE growth of 6H-SiC)
ó‰ª@NA•½–{‰ëM*,’J–ì‹g–í*,ŽR“c‰vŽO*,ŠÝ“cº•F,²–ì’¼Ž,‹àŽq’‰º
iŠÖ¼Šw‰@‘åŠwA*“ú–{ƒsƒ‰[H‹Æj
SiCƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·
P8 Si (001)Šî”Âã‚Ö‚Ì‘å–ÊÏ3C-SiCƒwƒeƒƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·|3C-SiC‚ÌŒ‹»•]‰¿|
(Large area 3C-SiC hetero-epitaxial growth on Si (001) substrate. -Evaluation of 3C-SiC crystal defects-)
‰ÍŒ´FŒõA”ª–Ø–M–¾A’·àVOK
iHOYAj
P9 ‹C‘Š¬’·‚É‚¨‚¯‚éƒ}ƒCƒNƒƒpƒCƒv•Âǂ̉ðÍ
(Analysis of micropipe closing via 4H-SiC vaporphase epitaxy)
Š™“cŒ÷•äA“y“cGˆêA’¼–{@•ÛAò@–M˜a
i“d—Í’†‰›Œ¤‹†Šj
P10 DMS‚ð—p‚¢‚½SiCƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·‚̉Šú‰ß’ö
(Initial stage of SiC epitaxial growth using dimethylsilane.)
¬“c@ŽAˆÀˆäŠ°Ž¡AÔ‰H³Žu
i’·‰ª‹Zp‰ÈŠw‘åŠwj
P11 ‰ž—͊ɘa‹@\‚ðŽ‚ƒVƒŠƒRƒ“Šî”Âã‚Ö‚Ì3C-SiCŒ‹»¬’·
(Growth of 3C-SiC Layers on Silicon Substrates with a Novel Stress Relaxation Structure)
Fì–FGAŽR“c@“oAŽ÷_‰ëlA‰Á’n@“O
i–L“c’†‰›Œ¤‹†Šj
P12 —L‹@ƒVƒ‰ƒ“–@‚É‚æ‚éSiC/SiŠE–ʃoƒbƒtƒ@‘w‚ÌŒ`¬
(Formation of the interfacial buffer layer by organo-silane method)
’†àV“úoŽ÷A––ŒõáÁŠó
i“Œ–k‘åŠwj
P13 ’ᑬƒCƒIƒ“ƒr[ƒ€‚É‚æ‚éSi (100)’Y‰»”½‰ž
(Carbonization process of a Si (100) surface using low-velocity ion beams)
’Ø“àM‹PA’ƒ’JŒ´º‹`A–ؖ쑺~A–x–ì—TŽ¡
iH‹Æ‹Zp‰@‘åãH‹Æ‹ZpŒ¤‹†Šj
P14 ”Mˆ—‚É‚æ‚é’Y‰»‘w‚ÌSiC‰»Œ»Û
(Transformation of Carbon layer into SiC under Annealing Condition)
‰œ–ì‰pˆêA“V–ìLŽ¡
iƒfƒ“ƒ\[j
P15 ‘å“d—¬–§“xƒCƒIƒ“’“ü‚É‚æ‚é–„‚ßž‚ÝSiC‘w‚ÌŒ`¬
(Buried SiC layer formation by high current density ion implantation)
¼“‡Œ’ŽjA‘]‰ä•”Œ“ŽjAˆÀ•”Œ÷“ñA]—´@CA’†“ˆŒ˜Žu˜Y
i–¼ŒÃ‰®H‹Æ‘åŠwj
P16 —L‹@Œ]‘f‰»‡•¨‚ð—p‚¢‚½SiŠî”Âã‚Ö‚Ì3C-SiC”––Œ¬’·‚¨‚æ‚Ñ•]‰¿
(Growth and estimation of 3C-SiC film on Si substrate using Si2(CH3)6 )
ˆÉŠÖ@‹BA“¡‰ª—mˆêA󌩒¼‰›A•ÄˆäŒ’Ž¡
iŽÅ‰YH‹Æ‘åŠwj
P17 Si(001)Šî”Âã3C-SiCƒwƒeƒƒGƒs–Œ‚ÌAPDÁŽ¸‹@\(2)@|’Y‰»–Œ‚ÌŒø‰Ê|
(The APD annihilation mechanism of 3C-SiC hetero-epilayer on Si(001) substrate (II)
-The effect of carbonized layer-)
Γc—[‹NA‚‹´“O•vA‰œ‘º@Œ³A‹g“c’åŽj*
i“dŽq‹Zp‘‡Œ¤‹†ŠAé‹Ê‘åŠw*j
P18 3C-SiCƒwƒeƒƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·‚É‚¨‚¯‚鬒·‰Šú‰ß’ö‚̉e‹¿
(Effect Early Stage of Growth in Heteroepitaxial Growth of 3C-SiC on Si)
‚‹´“O•vA‰ª@‘ñ–*AΓc—[‹NA‰œ‘º@Œ³A‹g“c’åŽj**Arˆä˜a—Y
i“dŽq‹Zp‘‡Œ¤‹†ŠA“ú–{‘åŠw*Aé‹Ê‘åŠw**j
P19 ƒ¿-SiC’PŒ‹»Šî”Âã‚ł̃À-SiC‘½Œ‹»‚©‚ç‚̃¿-SiC’PŒ‹»‚̌őŠ¬’·
(Solid phase epitaxial growth of ƒ¿-SiC from poly-Crystalline ƒÀ-SiC on ƒ¿-SiC Seed substrate)
’J–ì‹g–íA•½–{‰ëMA’JŠ_‹P”VA˜a“cŒ\ŽiA‘O“c—˜‹vAŽR“c‰vŽO
i“ú–{ƒsƒ‰[H‹Æj
P20 15R-SiC (000_1)C–ʂ̃Gƒbƒ`ƒsƒbƒgŠÏŽ@
(Observation of etch pits on 15R-SiC (000_1) C-face)
¼Œû‘¾˜YA´…—˜”VA²X–ØMA‘åê@ŒåA¼–ì–ÎO
i‹ž“sHŒ|‘@ˆÛ‘åŠwj
P21 6H-SiCã‚É15R-SiC‚ª”¶‚·‚郃JƒjƒYƒ€‚ÌlŽ@
(Study of 15R-SiC growth mechanism on 6H-SiC)
¬ŒI‰p”üAœA£•x²—YA¼ˆäFŽjA ‰i‹v•Û‰ë•vA ‰¶“c³ˆê
iƒfƒ“ƒ\[j
P22 <1-100>‹y‚Ñ<11-20>•ûŒü‚ɃIƒt‚µ‚½4H-SiCŠî”‚ւÌCVD¬’·
(CVD growth of 4H-SiC inclined towards <1-100> and <11-20>)
‘“c‘׈êA‘åê@ŒåAChacko JacobA¼–ì–ÎO
i‹ž“sHŒ|‘@ˆÛ‘åŠwj
P23 (11_20)–Êã‚Ö‚ÌpŒ^4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·‚Æ‚»‚Ì•]‰¿
(Growth and characterization of p-type 4H-SiC epitaxial layer on (11_20) face)
Ž™“‡ˆê‘1,2A‘å–ìr”V1,3A‹ù•”ŒõO1,3A¹Œ´@èM1,3AΓc—[‹N1,2A‚‹´“O•v1,2A—é–Ø—_–ç1,3A
‹g“c’åŽj1,2A“c’†’ms1,3Arˆä˜a—Y1,2
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì1A“dŽq‹Zp‘‡Œ¤‹†Š2AV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3j
P24 Epitaxial growth of SiC in hydrogen atmosphere by sublimation close
space technique
T.Furusho, S.K.Lilov*, S.Ohshima and S.Nishino
iKyoto institute of teclmology, *University of Sofia:Bulgariaj
P25 ’áƒIƒtŠp4H-SiC (0001)Šî”ÂãƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·‚Ì•\–ʃ‚ƒtƒHƒƒW[§Œä
(Control of Surface Morphologies for Epitaxial Growth on Low Off-Angle 4H-SiC (0001)
Substrates)
¹Œ´@èM1A‹ù•”ŒõO1AŽ™“‡ˆê‘‚PA‘å–ìr”V1AΓc—[‹N2A‚‹´“O•v2A—é–Ø—_–ç1A
“c’†’ms1A‹g“c’åŽj2Arˆä˜a—Y2
iV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï1A“dŽq‹Zp‘‡Œ¤‹†Š2j
P26 4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·–Œ‚Ì”½ŽË‡]üƒgƒ|ƒOƒ‰ƒtŠÏŽ@
(Reflection X-ray topograph observation of 4H-SiC epitaxial films)
‘å–ìr”V1,2AŽRŒû”Ž—²1,3A‹ù•”ŒõO1,2A¹Œ´@èM1,2AŽ™“‡ˆê‘1,3A‚‹´“O•v1,3AΓc—[‹N1,3A
—é–Ø—_–ç1,2A‹g“c’åŽj1,3Arˆä˜a—Y1,3
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì1 AV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï2A“dŽq‹Zp‘‡Œ¤‹†Š3j
P27 SiC¸‰Ø–@‚É‚¨‚¯‚é’‚‘f‚ÌŽæž‚Ý‹@\‚ɂ‚¢‚Ä‚ÌlŽ@
(Study on Mechanism of Nitrogen Incorporation in Sublimation Growth of SiC)
“à“¡³”üAŒ´@ˆê“s, œA£•x²—YA‰¶“c³ˆê
iƒfƒ“ƒ\[j
P28 a-SiC‚̃vƒ‰ƒYƒ}CVD‰ß’ö‚É‚¨‚¯‚鬒·ƒJƒCƒlƒeƒBƒNƒX‚Æ–Œ‚ÌÔŠO‹zŽû•ªŒõ“Á«
(Growth kinetics of a-SiC on RF plasma-enhanced CVD and FT-IR analysis of the film)
‹àŽq@ãàA‹{ìé–¾A”Ñì—T–ç
i“Œ‹ž—‰È‘åŠwj
P29 cŒ^ƒzƒbƒgƒEƒH[ƒ‹CVD‚É‚æ‚éSiC‚Ì‚‘¬¬’·
(High-speed growth of SiC by vertical hot-wall CVD)
“¡•½ŒiŽqA“c‘º’®”VA–Ø–{P’¨A¼”gO”V
i‹ž“s‘åŠwj
P30 4H-SiCƒGƒsƒ^ƒLƒVƒƒƒ‹’PŒ‹»‚ÌŒú–Œ‰»
(Growth of thick 4H-SiC epitaxial layers)
“y“cGˆêCŠ™“cŒ÷•äC’¼–{@•ÛCò@–M˜a
i“d—Í’†‰›Œ¤‹†Šj
P31 First 5x3"/7x2" Hot-Wall Planetary Reactor for the CVD Growth of Large Area SiC
Frank Wischmeyer(1)CJohannes Kappeler(2)CRune Berge(1)CJan-Olov Fomell(1)C
Holger Jurgensen(2)
i(1)EPIGRESS AB:SWEDEN, (2)AIXTRON AG:GERMANYj
P32 ‰¡Œ^ƒzƒbƒgƒEƒH[ƒ‹CVD˜F‚ð—p‚¢‚½4H-SiC‚̃Gƒsƒ^ƒLƒVƒƒƒ‹¬’·
(Epitaxial growth of 4H-SiC by using Horizontal Hot-Wall type CVD Reactor)
‹ù•”ŒõO1,3A¹Œ´@èM1,3AŽ™“‡ˆê‘1,2A‘å–ìr”V1,3AΓc—[‹N1,2A‚‹´“O•v1,2A—é–Ø—_–ç1,3A
‹g“c’åŽj1,2A“c’†’ms1,3Arˆä˜a—Y1,2
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì1A“dŽq‹Zp‘‡Œ¤‹†Š2AV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3j
P33 ‰¡Œ^ƒR[ƒ‹ƒhƒEƒH[ƒ‹CVD‚É‚æ‚郿-SiC‚‘¬ƒzƒ‚ƒGƒsƒ^ƒLƒVƒƒƒ‹¬’·‘w‚Ì•¨«•]‰¿
(Characterization of ƒ¿-SiC epilayers grown by horizontal cold-wall CVD at high growth rates)
’†‘ºrˆêA–Ø–{P’¨A¼”gO”V
i‹ž“s‘åŠwj
SiC•¨«•]‰¿
P34 3C-SiC/SiƒwƒeƒƒGƒsƒ^ƒLƒVƒƒƒ‹–Œ‚̃‰ƒ}ƒ“ŽU—•]‰¿
(Characterization of 3C-SiC Heteroepitaxial Films by Raman scattering)
’†“‡Mˆê*A’†•‘׌[*A”d–@O**
i*‹{è‘åŠwA**‘åã‘åŠwj
P35 ƒ‰ƒ}ƒ“ŽU—‚É‚æ‚éSiC-Ni“d‹É”½‰ž‚ÌŒ¤‹†
(Raman Study on the SiC-Ni electrode Reaction)
ŒI–{‰pŽ¡1A”d–@O1A’†“‡Mˆê2AŠâŒ©ŠîO3AŒË“c’‰•v4AàV“c@–«4
i‘åã‘åŠw1A‹{è‘åŠw2A‰ªŽR‘åŠw3AŽO—m“d‹@4j
P36 ƒ‰ƒ}ƒ“ŽU—‚É‚æ‚é3C-SiCƒzƒ‚ƒGƒsƒ^ƒLƒVƒƒƒ‹–Œ‚ÌÏ‘wŒ‡Š×‚Ì•]‰¿
(Raman Scattering Characterization of Stacking Faults in 3C-SiC Homo-Epitaxial Films)
’†•‘׌[*A’†“‡Mˆê*AΓc—[‹N**A“y“cGˆê***
i*‹{è‘åŠwA**“dŽq‹Zp‘‡Œ¤‹†ŠA***“d—Í’†‰›Œ¤‹†Šj
P37 SiC´ò•\–Ê‚Ì\‘¢
(Structures of Clean SiC Surfaces)
‹v“cË”VAÂŽR•üO*AŠØ@‹Êž^*AŒü’†–ìMˆêA’·’J쌒Aˆê‹{•V•F*
iƒfƒ“ƒ\[A*–¼ŒÃ‰®‘åŠwj
P38 nŒ^6H-SiC(0001) just faceã‚ÌSi–Ê‹y‚ÑC–Ê‚Ì•\–Ê\‘¢|ƒGƒbƒ`ƒ“ƒOEŒ¤–ƒvƒƒZƒXˆË‘¶«|
(Surface structure on Si and C face of n type 6H-SiC(0001) just face -dependence of etching and polishing processes-)
´…”Ž‹IA‹´–{@Œ’AˆÀ•”Œ÷“ñA]—´@CA’†“ˆŒ˜Žu˜Y
i–¼ŒÃ‰®H‹Æ‘åŠwj
P39 4H-SiCã‚Ì“ñ‘w\‘¢Ž_‰»–Œ‚ÌŒø‰Ê
(Optimizing annealing process for double oxide layers on 4H-SiC)
‹àŽq²ˆê˜YA‹Ë’J”Í•FA’J–{@’qAŽR’†@ÓA¯@³Ÿ
i“úŽYŽ©“®ŽÔj
P40 SiC•\–ʈ—iŽ_‰»C…‘f”Mˆ—j‰ß’ö‚Ì‚»‚ÌꕪÍ
(In-situ analysis of thermal oxidation and hydrogen annealing on SiC surface)
’¼–{@•ÛC“y“cGˆêCŠ™“cŒ÷•äCò@–M˜a
i“d—Í’†‰›Œ¤‹†Šj
P41 —z‹ÉŽ_‰»–@‚É‚æ‚é6H-SiCã•\–Ê‘w‚Ì‹]µŽ_‰»
(Sacrificial oxidation of 6H-SiC by the anodic oxidation method)
‰Á“¡³ŽjAŽs‘º³–çArˆä‰p•ã
i–¼ŒÃ‰®H‹Æ‘åŠwj
P42 O2ƒvƒ‰ƒYƒ}‚É‚æ‚éSiCŽ_‰»–Œ‚̒ቷŒ`¬(2)
(Low temperature formation of SiC Oxide Films by O2 plasma (2)
“‡“c‹v‹LA–öŒ´²’mŽqA’†‘º’qéA²“¡F
i–@‘åŠwj
P43 4H-A6H-SiC‚É‚¨‚¯‚é‹óEƒNƒ‰ƒXƒ^[‚ÌESR‚É‚æ‚錤‹†
(ESR study on vacancy clusters in 4H- and 6H-SiC)
…—ŽŒ›˜a1,2Aˆé’J‡ˆê1,2A ŽRè@‘2A‘ëàVtŠì3AX‰ºŒ›—Y3A‘哇@•3AˆÉ“¡‹v‹`3
i}î‘å1AJRCAT-—Z‡Œ¤2AŒ´Œ¤‚è3j
P44 ƒpƒ‹ƒXƒŒ[ƒU[ƒAƒj|ƒŠƒ“ƒO‚É‚æ‚éƒCƒIƒ“’“üSiC‚ÌŒ‹»«‰ñ•œ
(Recrystalization of ion implanted SiC by pulsed laser annealing)
ÂŽRŒõ‘¾˜YA…“c¬‘¥AˆÀ•”Œ÷“ñA]—´@CA’†“ˆŒ˜Žu˜Y
i–¼ŒÃ‰®H‹Æ‘åŠwj
P45 3C-SiC’†‚ÌŒ‡Š×‚ɑ΂·‚é…‘fƒvƒ‰ƒYƒ}ˆ—‚̉e‹¿
(Effect of hydrogen-plasma treatment on defects in 3C-SiC)
1‘c•ƒ]•¶FA1‰Á“¡³ŽjA1Žs‘º³–çA1rˆä‰p•ãA2ŽR“c@“oA3“¿“c@–LA4‰œ‘ºŽŸ“¿
i1–¼ŒÃ‰®H‹Æ‘åŠwA2–L“c’†‰›Œ¤‹†ŠA3ˆ¤’mH‹Æ‘åŠwA4“Œ‹ž“s—§‘åŠwj
P46 SiCƒGƒs‘w|ƒoƒ‹ƒNŠE–Ê‚É‘¶Ý‚·‚é[‚¢€ˆÊ‚Ì“™‰·‰ß“n—e—Ê•ªŒõ–@‚É‚æ‚鑪’èB
(Observation of deep levels at interface of epitaxial SiC and bulk SiC by use of isothermal capacitance transient spectroscopy)
“¡Šª@^1,2A‹ù•”ŒõO1,3A¹Œ´èM1,3AŽ™“‡ˆê‘1,2AŽlŒËF1,3A‘å‹øG¢1,2Arˆä˜a—Y1,2
i’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì1A“dŽq‹Zp‘‡Œ¤‹†Š2AV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ï3j
P47 •ªŒõƒGƒŠƒvƒ\ƒ[ƒ^[‚É‚æ‚éSiCŽ_‰»–Œ‚Ì‹üÜ—¦‚Ì•]‰¿
(Characterization of refractive index profile of oxide films on SiC by spectroscopic ellipsometer)
”Ñ“cŒ’*1A•x‰ª—Yˆê*1A’Ë“c_”V*1A—Î쳕F*1A‹g–{˜a¶*1A“y•û‘דl*1A–îŒû—T”V*1A
‹gì³l*2AΓc—[‹N*3A‹g“c’åŽj*1*3
i*1é‹Ê‘åŠwA*2“ú–{Œ´Žq—ÍŒ¤‹†ŠA*3“dŽq‹Zp‘‡Œ¤‹†Šj
P48 6H-SiC(00E1)ƒIƒtŠî”‚ɂ¨‚¯‚éƒ}ƒCƒNƒƒpƒCƒvŽü•Ó‚ÌŒõ’e«ƒpƒ^[ƒ“
(Pbotoelastic Pattern around the Micropipe with Off-Angledi00E1j6H-SiC Substrates
‘å—¢@êŽA˜a“cŒ«‰î
i–¼ŒÃ‰®H‹Æ‘åŠwj
P49 ‚‰·‚É‚¨‚¯‚éSiC‚Ì•ªŒõƒGƒŠƒvƒ\ƒƒgƒŠ[
(Spectroscopic ellipsometry of SiC at high temperaturej
‹v•Û’¼‹IAŽR“c‚Š°AX’J–¾OAŸ–쳘a–A‘å’J@¸–
i“‡ª‘åŠwAV“ú–{»èc–j
P50 SiO2/nŒ^SiC(11-20)‚É‚¨‚¯‚é󂢊E–Ê€ˆÊ
(Shallow States at SiO2/n-type SiC(11_20) Interface)
–î–ì—TŽiA–Ø–{P’¨A¼”gO”V
i‹ž“s‘åŠwj
P51 6H-SiC‚É‚¨‚¯‚鎩—R“dŽq‚Ì“`“±‘ÑŠÔ’´‚‘¬ŠÉ˜a‰ß’ö
(Ultrafast inter-conduction-band electron relaxation processes in 6H-SiC)
•x“c‘ì˜N1AâV“¡LŒá1A––Œ³@“O1A”d–@O2A’†“‡Mˆê3
i“Œ‹ž‘åŠw1A‘åã‘åŠw2A‹{è‘åŠw3j
P52 ‘–¸ƒI[ƒWƒF•ªŒõ–@‚É‚æ‚éSiO2/SiCŠE–Ê‚Ì‘g¬•ªÍ
(Composition Analysis of SiO2/SiC Interface by Scanning Auger Electron Spectroscopy)
“y•û‘דlA”Ñ“c@Œ’A–îŒû—T”VA‹gì³l*A‹g“c’åŽj
ié‹Ê‘åŠwA*“ú–{Œ´Žq—ÍŒ¤‹†Šj
P53 [Ž‡ŠOƒŒ[ƒU[—ã‹NPL‚É‚æ‚é4H SiC ƒGƒsƒEƒGƒn[‚Ì•]‰¿
(Characterization of SiC Epitaxial Wafers by PL under Deep UV Excitation)
“c’†Œõ”Ža,bA“c“‡“¹•vaA²–ì‰ë•qb
ia‰F’ˆ‰ÈŠwŒ¤‹†ŠAb“Œ‹ž—‰È‘åŠwj
P54 Cu/3C-SiCÚ‡Œn‚ÌŠE–Ê”½‰ž‹y‚Ѷ¬•¨‚̉¿“dŽq‘Ñ\‘¢
(Study of the reaction at Cu/3C-SiC interface and valence-band electronic structure of the reaction product)
ˆÀU˜AA•½ˆä³–¾A“ú‰ºª•FAŠâ”üŠîO
i‰ªŽR‘åŠwj
SiCƒfƒoƒCƒXEƒvƒƒZƒX
P55 Cu/ ƒ¿-SiCÚ‡ƒVƒ‡ƒbƒgƒL[á•Ç‚‚³§Œä
(Control of Schottky Barrier Height in Cu/ ƒ¿-SiC Junctions)
ìl˜a–¾AŽOã‰p‘¥A‹M“‡—mŽjA”¨ŽR’q—ºA‰Y‰ªsŽ¡A“~–Ø@—²
i“Þ—Çæ’[‰ÈŠw‹Zp‘åŠw‰@‘åŠwj
P56 ƒGƒLƒVƒ}ƒŒ[ƒU[ÆŽË‚É‚æ‚éSiC‚Ö‚ÌCuƒI[ƒ~ƒbƒN“d‹É‚ÌŒ`¬
(Copper ohmic contacts to SiC fabricated with pulsed excimer laser irradiation)
ˆÀ•”Œ÷“ñAZ—F³´A]—´@CA’†“ˆŒ˜Žu˜Y
i–¼ŒÃ‰®H‹Æ‘åŠwj
P57 Žº‰·Œ`¬‚µ‚½Al/nŒ^4H-SiC’á’ïRƒI[ƒ~ƒbƒNƒRƒ“ƒ^ƒNƒg
(Low ohmic contact resistance of Al/n-type 4H-SiC contacts processed at room temperature)
‘Œ©‘×–¾1,3A’J–{@’q1,3A¯@³Ÿ1,3A‘å‹øG¢2,3
iV‹@”\‘fŽqŠJ”‹¦‰ï1A“dŽq‹Zp‘‡Œ¤‹†Š2A’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘Ì3j
P58 1/f“d—¬ŽG‰¹‘ª’è‚É‚æ‚é4H-SiC‚̃I[ƒ~ƒbƒN“d‹É‚Ì•]‰¿
(Characterization of Ohmic Contact for 4H-SiC by 1/f Current Noise Measurement)
“cÀL‹vA‰¡‘qŽO˜YAŒÜ\—’“oA‘é–ì’v˜a
i–¾¯‘åŠwj
P59 ƒRƒ“ƒ^ƒNƒgŒ`¬‚ÉRIE‚ðŽg—p‚µ‚½ƒI[ƒ~ƒbƒN“d‹É‚Ì“Á«
(Characteristics of ohmic contact after reactive ion etching)
™–ì@ŠwA¯@³ŸA’J–{@’qAŽR’†@v
i“úŽYŽ©“®ŽÔj
P60 6H-SiC‚Ö‚ÌTaSi2ƒI[ƒ~ƒbƒN“d‹É‚Ìì»
(Fabrication of TaSi2 ohmic contacts for 6H-SiC)
‹g“c˜aO1)A‹g“c@O1)A‰œŽRN¶2)AˆÀ•”Œ÷“ñ1)A]—´@C1)A’†“ˆŒ˜Žu˜Y1)
i1)–¼ŒÃ‰®H‹Æ‘åŠwA2)“ú–{“ÁŽê“©‹Æj
P61 Formation of silicides and carbides in Ti(film)/4H-SiC(000|1)(substrate) system
J. Labis, A. Ohi, T. Fujiki, M. Hirai, M. Kusaka, and M. Iwami
iOkayama Univ.j
P62 N2{ƒCƒIƒ“’“ü6H-SiC‚Ì”Mˆ—“Á«
(Annealing characteristics of N2+-ion implantation in 6H-SiC)
Šâ“c@‘åA™ŽRŒúŽuAˆî“c‘¾˜Y
i–@‘åŠwj
P63 ‚‰·ƒCƒIƒ“’“ü‚É‚æ‚éSiC-MESFETƒ\[ƒX’ïR‚̒ጸ
(Source resistance reduction by hot ion implantation in SiC-MESFET)
‘òè_ŽjA ”öŒ`@½A –{“cO‹BA ¬–ì CˆêA Vˆä@ŠwA –k‘º¹—Ç
iV“ú–{–³üj
P64 AlƒCƒIƒ“’“ü‚ðs‚Á‚½4H-SiC‚Ì“d‹C“Á«
(Electrical characteristics of Aluminum ion implanted 4H-SiC)
“c’†G–¾A™–ì@ŠwA’J–{@’qAŽR’†@vA¯@³Ÿ
i“úŽYŽ©“®ŽÔj
P65 As+’“ü4H-SiC‚Ì’“ü‘wÄŒ‹»‰»‰ß’ö
(Recrystallization Process for As+ Implanted Layers into 4H-SiC)
æ핃Žõ1,2A‘å–ìr”V1,3A¬™—ºŽ¡1,2AŒ´“cM‰î1,2A—é–ؽ“ñ1,3A•Ÿ“cŒ›Ži1,2Arˆä˜a—Y1,2
i’´’ᑹŽ¸“d—Í‘fŽqŒ¤‹†‘Ì1A“dŽq‹Zp‘‡Œ¤‹†Š2AV‹@”\‘fŽqŠJ”‹¦‰ï3j
P66 ƒCƒIƒ“’“ü–@‚É‚æ‚è쬂µ‚½Er“Y‰Á‚SH-SiC‚Ì”Œõ
(Photoluminescence from Er-implanted 4H-SiC)
Œã“¡‹M”VAA‘Vˆê˜Y
i–¾Ž¡‘åŠwj
P67 pnÚ‡‚ð—p‚¢‚½SiC‚‰·“®ìƒKƒXƒZƒ“ƒT
(SiC pn-junction Diode Type Gas Sensor for High Temperature Applications)
‰œŽRN¶1)AˆÀ“¡ËŽq2)A–ì–{˜aº2)A‰¡ˆä“™1)A‘哇’•¶1)AˆÀ•”Œ÷“ñ2)A]—´@C2)A
’†“ˆŒ˜Žu˜Y2)
i1j“ú–{“ÁŽê“©‹ÆA2)–¼ŒÃ‰®H‹Æ‘åŠwj
P68 ƒfƒ‹ƒ^ƒh[ƒv\‘¢ƒAƒLƒ…ƒ~ƒ…ƒŒ[ƒVƒ‡ƒ“ƒ`ƒƒƒ“ƒlƒ‹‚ð—p‚¢‚½4H-SiC MOS-FET
(4H-SiC MOS-FET with delta-doped accumulation-channel)
‰¡ìrÆA‚‹´–M•ûA“í–{@CA“à“c³—YA–k”©@^
i¼‰º“dŠíŽY‹Æj
P69 6H-SiCƒfƒ‹ƒ^ƒh[ƒv\‘¢‚Ì“dŽq—A‘—“Á«‚ÆMES-FET‚ւ̉ž—p
(Electronic transport of 6H-SiC delta-doped structure and its application for FET)
‰¡ìrÆA‚‹´–M•ûA“í–{@CA“à“c³—YA–k”©@^
i¼‰º“dŠíŽY‹Æj
P70 Effect of off-angle from Si (0001) face on SiO2/SiC interface properties
of SiC MOS structures
K. Fukuda1, S. Suzuki2, J. Senzaki1, R. Kosugi1, S. Harada1, T. Tanaka2, and K. Arai1
i1UPR Electrotechnical Laboratory, 2UPR R & D Association for Future Electron Devicesj
P71 ‚SH-SiC MOSŠE–Ê‚ÆMOSFET“Á«‚Ì‘ŠŠÖ
(Relationships between 4H-SiC MOS interface and MOSFET properties)
—é–ؽ“ñ1AŒ´“cM‰î2Aæ핃Žõ2A¬™—ºŽ¡2A•Ÿ“cŒ›Ži2A“c’†’ms1Arˆä˜a—Y2
i1UPR/V‹@”\‘fŽqŠJ”‹¦‰ïA2UPR/“dŽq‹Zp‘‡Œ¤‹†Šj
P72 4H-‚¨‚æ‚Ñ6H-SiC MOSFETs ‚̉·“xˆË‘¶«
(Temperature dependence of 4H- and 6H-SiC MOSFETs)
Œ´“cM‰î1),2)A¬™—ºŽ¡1),2)Aæ胎õ1),2)A—é–ؽ“ñ1),3)A•Ÿ“cŒ›Ži1),2)Arˆä˜a—Y1),2)
i1j ’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘ÌA2j“dŽq‹Zp‘‡Œ¤‹†ŠA3jV‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ïj
P73 LTOƒQ[ƒg≖Œ4H-SiC MOSŠE–Ê“Á«
(Interfacial characteristics of LTO/4H-SiC MOS capacitor)
¬™—ºŽ¡1, 2Aæ⌳Žì1, 2A—é–ؽ“ñ2, 3Aæ胎õ1, 2AŒ´“cM‰î1, 2A•Ÿ“cŒ›Ži1, 2Arˆä˜a—Y1, 2
i1“dŽq‹Zp‘‡Œ¤‹†ŠA2’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘ÌA3V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ïj
P74 Effect of activation annealing time on the micro-structural and electrical
properties of Al implanted 4H-SiC
Rajesh Kumar Malhan and Hiroki Nakamura
iDENSOj
P75 ‚SH-SiCƒVƒ‡ƒbƒgƒL[ƒ_ƒCƒI[ƒh‚̑ψ³\‘¢‚ÌŒŸ“¢
(Edge Termination of 4H-SiC SBD)
“¡àVLKA’Ò@’A‰¬–ìTŽŸA“y“cGˆê–AŠ™“cŒ÷•ä–A’¼–{@•Û–Aò@–M˜a–
i•xŽm“d‹@‘‡Œ¤‹†ŠA“d—Í’†‰›Œ¤‹†Š–j
P76 ‘–¸Œ^ƒLƒƒƒpƒVƒ^ƒ“ƒX‘ª’è–@‚É‚æ‚éSiCÚ‡Œ`ó•]‰¿
(Analysis of SiC junction profile analysis by the scanning capacitance measurement)
¬–ì£GŸA“n•Ó“Ä—YA‰¡“c•ŽiAÎì@“§Aõ’J—FKAŽO•r@—EA”ª”ö@•×A¬—Ñ@—T
i“ú—§»ìŠj
P77 4H-SiCƒVƒ‡ƒbƒgƒL[ƒoƒŠƒAƒ_ƒCƒI[ƒh‚Ì‹t•ûŒü“Á«‰ðÍ
(Reverse Characteristics of 4H-SiC Schottky Barrier Diode)
”©ŽR“N•vA¡ˆä¹ŽxAŽlŒË@F
i1j’´’ᑹŽ¸“d—Í‘fŽq‹ZpŒ¤‹†‘ÌA2)V‹@”\‘fŽqŒ¤‹†ŠJ”‹¦‰ïj
P78 ƒQ[ƒgŽ_‰»–Œ…ö‹Cˆ—‚µ‚½6H-SiC MOSFET‚̃Kƒ“ƒ}üÆŽË‚É‚æ‚é“Á«•Ï‰»
(Influence of gamma-ray irradiation on the characteristics of 6H-SiC MOSFET with steam-annealed gate oxide)
‘哇@•AˆÉ“¡‹v‹`A‹gì³l
i“ú–{Œ´Žq—ÍŒ¤‹†Šj
P79 Ž_‘fƒCƒIƒ“’“üƒVƒŠƒRƒ“ƒJ[ƒoƒCƒh‚É‚¨‚¯‚é–„‚ßž‚Ý”ñ»Ž¿‘w‚Ì\‘¢‰ðÍ
(Structural analysis of buried amorphous layers in oxygen-ion-implanted silicon carbide)
ΊÛ@ŠwAO’Ã’õ•F
i‘åã‘åŠwj
ƒ_ƒCƒ„ƒ‚ƒ“ƒh‚¨‚æ‚ÑŽ_‰»•¨
P80 ‹à‘®^CVDƒ_ƒCƒ„ƒ‚ƒ“ƒh”––Œ‚ÌÚ‡“Á«
(Junction Properties of Metal/CVD Diamond Films)
ŽR’†’å‘¥A’|“à‘å•ãA‘å‹ø‰p¢
i“dŽq‹Zp‘‡Œ¤‹†Šj
P81 ƒ_ƒCƒ„ƒ‚ƒ“ƒh”––Œ‚ÌŠiŽqóŒ`¬‚É‚æ‚éƒGƒ~ƒbƒVƒ‡ƒ“ƒTƒCƒg”‚Ì‘‘å
(Increase in number of emission site by embossment deposition of diamond film)
¼ì”NŽõA‘å–î@„A¯@‘P”VAŠâ£–ž—YA˜aò•x—Y
i“ŒŠC‘åŠwj
P82 ƒŒ[ƒU[ƒAƒuƒŒ[ƒVƒ‡ƒ“–@‚É‚æ‚éƒTƒtƒ@ƒCƒAŠî”Âã‚ւ̃Gƒsƒ^ƒLƒVƒƒƒ‹TiO2”––Œ‚Ì컂ƕ]‰¿
(Fabrication and characterization of epitaxial TiO2 thin films on sapphire substrates by pulsed laser deposition)
ŽÂŒ´—³Ž™1)A”ªŠª“O–ç2)AZ“c‘׎j2)AŽR–{t–ç2)A‹{‰º“Ö–¤2)AˆÉ“¡‹v‹`2)AóˆäŒ\‰î1)
i1j“Œ‹ž‘åŠwA2)“ú–{Œ´Žq—ÍŒ¤‹†Šj
’‚‰»•¨
P83 RF-MBE‚É‚æ‚é‚•iŽ¿AlGaN/GaNƒwƒeƒ\‘¢‚Ì컋y‚Ñ‚»‚Ì•]‰¿
(Fabrication and characterization of high-quality AlGaN/GaN heterostructures grown by RF-MBE)
’¾ˆ®‹AˆäŽè—˜‰pA´…ŽO‘A‰œ‘º@Œ³
i“dŽq‹Zp‘‡Œ¤‹†Šj
P84 ‘I‘ðƒ}ƒXƒgƒ‰ƒ“ƒXƒ|[ƒg‚É‚æ‚é–Ê“àGaN/AlGaNƒwƒeƒ\‘¢‚Ìì»
(In-plane GaN/AlGaN Heterostructures by Selective Mass Transport)
Ä“¡^ˆêA“’ì—m•½A¬›½³–FAV“cBŒáAŠâ’J‘fŒ°AŽRŒû‰h—YA“V–ì@_AÔí•@—E
i–¼é‘åŠwj
P85 —§•û»InGaNA‹y‚ÑInGaN/GaN‘½d—ÊŽqˆäŒË\‘¢‚Ìrf-MBE¬’·‚Æ•]‰¿
(Growth and characterization of cubic InGaN and InGaN/GaN multiple quantum wells by rf-MBE
–k‘ºŽõ˜NA*—é–ØËmAΓc—[‹NA’¾ˆ®‹A *’†¼‹vKA**’•ƒd‰pA‰œ‘º@Œ³
i“dŽq‹Zp‘‡Œ¤‹†ŠA*“Œ‹ž—‰È‘åŠwA**’}”g‘åŠwj
P86 rf-MBE‚É‚æ‚èGa‹É«¬’·‚µ‚½AlGaN/GaNƒwƒeƒÚ‡FET
(AlGaN/GaN Heterojunction Field Effect Transistors Using Ga-polarity Crystal grown by rf-MBE)
ˆäŽè—˜‰p*A´…ŽO‘**A—é–Ø@WA’¾ˆ®‹A‰œ‘º@Œ³*Aª–{r—Y
i“dŽq‹Zp‘‡Œ¤‹†ŠA*–¾Ž¡‘åŠwA**“ŒŠC‘åŠwj
P87 ƒTƒtƒ@ƒCƒAŠî”ÂãAlxGa1-xN‚̃Vƒ‡ƒbƒgƒL[“Á«
(Characteristics of Schottky barrier diodes or AlxGa1-xN on Sapphire)
‘å–ì²mAÎ씎NA]ìFŽuA_•ÛFŽuAâ–{@Œ÷A”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P88 Schottky contacts of Ni/Au on n-GaN grown on sapphire and SiC substrates
B. J. Zhang, G. Y. Zhao, N. Nishikawa, M. Adachi, H. Ishikawa, T. Egawa, T. Jimbo,
and M. Umeno
iNagoya Institute ofTechnologyj
P89 ”÷¬GaNƒVƒ‡ƒbƒgƒL[ÚG‚ð—p‚¢‚½“]ˆÊ‚Æ@I-V“Á«‚Æ‚Ì‘ŠŠÖ‚Ì•]‰¿
(The effect of dislocations to I-V characteristics of sub-ƒÊm GaN Schottky contacts)
‰–“‡ŒªŽŸA––Œõ“N–çA¬–¸[«*
iNTTƒtƒHƒgƒjƒNƒXŒ¤‹†ŠA‹ž“s‘åŠw*j
P90 ƒTƒtƒ@ƒCƒAŠî”ÂãGaInN MQWƒŒ[ƒU‚ÌŒõ—ã‹N“Á«
(Characteristics of Optical Pumped GaInN MQW Laser Diodes on Sapphire)
ŠÝ@’¼ŠóAÎ씎NA]ìFŽuA_•ÛFŽuA”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P91 GaNŒn–Ê”ŒõƒŒ[ƒU—pGaN/AlGaN DBR
(GaN/AlGaN DBR for GaN-based VCSEL)
’†“c®KAÎ씎NA]ìFŽuA_•ÛFŽuA”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P92 TiO2/SiO2—U“d‘Ì‘½‘w–Œ”½ŽË‹¾‚ð—p‚¢‚½ƒTƒtƒ@ƒCƒAŠî”ÂãInGaN MQW LED‚Ì‚o—͉»
(High power InGaN MQW LEDs on sapphire substrate with TiO2/SiO2 distributed Bragg reflectors)
Ε–õ_A’†“c®KAÎ씎NA]ìFŽuA_•ÛFŽuA”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P93 MOCVD¬’·’†‚É‚¨‚¯‚éSiŠî”ÂãGaN‚̃ƒ‹ƒgƒoƒbƒNƒGƒbƒ`ƒ“ƒO
(Meltback etching of GaN on Si substrate during the MOCVD growth)
Î씎NA]ìFŽuA_•ÛFŽuA”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P94 ƒtƒ‰ƒbƒNƒX–@‚ð—p‚¢‚½AlGaNƒoƒ‹ƒN’PŒ‹»‚̬’·
(Growth of bulk AlGaN crystals using Na flux method)
Goundar Kamal KishoreAˆÀˆäŠ°Ž¡AÔ‰H³Žu
i’·‰ª‹Zp‰ÈŠw‘åŠwj
P95 ŒõÆŽËMOCVD–@‚É‚æ‚éGaNP¬’·‚Æ•]‰¿
(GaNP grown by photo-assisted MOCVD and its characterization)
ˆÉ“Œ‹`—jA‹g“c´‹PAéì“ñ˜Y
iŒÃ‰Í“d‹CH‹Æj
P96 GaN‚É‚¨‚¯‚éGeŠˆ«‰»‚É‹y‚Ú‚·N/Ge“¯ŽžƒCƒIƒ“’“ü‚ÌŒø‰Ê
(Effect of N/Ge sequential co-implantation on the Ge activation of GaN)
’†–ì—R’A‰Á’n@“O
i–L“c’†‰›Œ¤‹†Šj
P97 “¯Ž²Œ^’¼Õ“˃CƒIƒ“ŽU—•ªŒõ–@‚É‚æ‚éƒEƒ‹ƒcŒ^GaN (0001)”––Œ‚Ì•\–Ê\‘¢‰ðÍ
(Surface Structual Analysis of Wurtzite GaN (0001) Film by Coaxial Impact Collision Ion Scattering Spectroscopy)
²Œ´@“OAž¸Œ´Š²‘åAˆÀ•”Œ÷“ñA]—´@CA’†“ˆŒ˜Žu˜YAÎ씎NA]ìFŽuA”~–쳋`
i–¼ŒÃ‰®H‹Æ‘åŠwj
P98 GaN‚É‚¨‚¯‚é—ã‹NŽq‚̈ʑŠ”j‰óŽžŠÔ‚̉·“xˆË‘¶«
(Temperature dependence of dephasing time in GaN)
‰H“¤kŽ¡1)AŽ“àŽü1)A@“cF”V1)A‘«—§@’q2)A’•ƒd‰p3)A’†‘ºC“ñ4)
i1j‘ˆî“c‘åŠwA2)–kŠC“¹‘åŠwA3)’}”g‘åŠwA4)“úˆŸ‰»ŠwH‹Æj
P99 Siƒh[ƒvnŒ^GaN‚É‚¨‚¯‚é‰i‘±Œõ“`“±
(Persistent photoconductivity in Si doped n-type GaN)
’†‘º’BlAŽ™“‡ˆê‘*A’¾ˆ®‹*A‰œ‘º@Œ³*A–îŒû—T”VA‹g“c’åŽj
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