Last modified: May 15, 2022
April 8 April 22, 2022 : Extended deadline for Abstract Submission/del>(closed)
- June 10, 2022 : Hard deadline for registration for presenters.
- July 22, 2022 : Deadline for registration for participants without presentation.
- July 30--August 1, 2022 : Conference
- September 30, 2022: Hard deadline for Paper Submission
- [May. 15, 2022] Registration site is now open.
- [Apr. 19, 2022] Presentation and Registration pages added.
- [Mar. 30, 2022]
Deadline for abstract submission is extended to April 22(closed).
- [Feb. 9, 2022] Cooperative societies added.
- [Jan. 29, 2022] Abstract submission page added.
- [Oct. 30, 2021] Invited speakers page added.
- [Sep. 1, 2021] The conference official webpage was launched.
Conference name: The 6th Asia-Pacific Conference on Semiconducting Silicides and Related Materials, 2022 (APAC-Silicide 2022)
Dates: July 30--August 1, 2022
In cooperation with:
- The Japan Society of Vacuum and Surface Science (JVSS)
- Kansai Chapter, the Japan Society of Applied Physics
- Thermoelectrics Society of Japan (TSJ)
- Japan Society of Thermophysical Properties
- Thin Film and Surface Physics Division, the Japan Society of Applied Physics
Official language: English
Yoshiaki Nakamura, Professor, Graduate School of Engineering Science, Osaka University
1-3 Machikaneyama-cho,Toyonaka, Osaka 560-8531, Japan
Email: firstname.lastname@example.org .