|
講演タイトル |
| 13:30〜14:00 |
The outlook for integration devices of MEMS and LSI
○Shuntaro Machida
(Hitachi, Ltd. Central Research Lab.) |
| 14:00〜14:30 |
Bumpless 3D Interconnects for the Tera-scale Bandwidth and High Density Devices Equivalent to <10nm Node Scaling
○Takayuki Ohba
(The Univ. of Tokyo) |
| 14:30〜15:00 |
Towards Sensors Implementation and Integration Using the CMOS MEMS Platform
Chuanwei Wang，Chih-Ming Sun，Ming-Han Tsai，Yu-Chia Liu，○Weileun Fang
(National Tsing Hua Univ.) |
| 15:00〜15:15 |
Break |
| 15:15〜15:45 |
System LSI Design and VDEC Activities toward More Than Moore
○Makoto Ikeda
(The Univ. of Tokyo) |
| 15:45〜16:15 |
MEMS Design in SPICE Environment
○Hiroshi Toshiyoshi1，Toshifumi Konishi2，Katsuyuki Machida2，Kazuya Masu3
(The Univ. of Tokyo1，NTT-AT2，Tokyo Inst. Tech3) |
| 18:00〜21:00 |
懇親会 |
